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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-0718-G-H

APH-0718-G-H

APH-0718-G-H

Samtec Inc.

2,186
APH-0718-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0322-G-R

APH-0322-G-R

APH-0322-G-R

Samtec Inc.

3,942
APH-0322-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1722-G-R

APH-1722-G-R

APH-1722-G-R

Samtec Inc.

4,152
APH-1722-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0422-G-R

APH-0422-G-R

APH-0422-G-R

Samtec Inc.

3,935
APH-0422-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0722-G-R

APH-0722-G-R

APH-0722-G-R

Samtec Inc.

2,219
APH-0722-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0818-G-H

APH-0818-G-H

APH-0818-G-H

Samtec Inc.

2,291
APH-0818-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1622-G-R

APH-1622-G-R

APH-1622-G-R

Samtec Inc.

3,798
APH-1622-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
117-93-316-61-005000

117-93-316-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,119
117-93-316-61-005000

Datasheet

117 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.070" (1.78mm) Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
37-0511-11

37-0511-11

CONN SOCKET SIP 37POS GOLD

Aries Electronics

3,200
37-0511-11

Datasheet

511 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
APA-640-G-N

APA-640-G-N

ADAPTER PLUG

Samtec Inc.

1,646
APA-640-G-N

Datasheet

APA Tube Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
126-93-952-41-002000

126-93-952-41-002000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

1,630
126-93-952-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-952-41-002000

126-43-952-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,211
126-43-952-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-11-652-41-001000

612-11-652-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,165
612-11-652-41-001000

Datasheet

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) - - Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
416-93-264-41-007000

416-93-264-41-007000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.

2,194
416-93-264-41-007000

Datasheet

416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) - Closed Frame - - - - - - -
110-43-648-61-105000

110-43-648-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,473
110-43-648-61-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
110-93-648-61-105000

110-93-648-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,786
110-93-648-61-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-93-650-41-003000

126-93-650-41-003000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

3,510
126-93-650-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
126-43-650-41-003000

126-43-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,193
126-43-650-41-003000

Datasheet

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
122-13-648-41-001000

122-13-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

3,435
122-13-648-41-001000

Datasheet

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-43-650-61-001000

111-43-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,598
111-43-650-61-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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