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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
111-43-628-61-001000

111-43-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,605
111-43-628-61-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-328-61-001000

111-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,500
111-93-328-61-001000

Datasheet

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-428-61-001000

111-93-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,687
111-93-428-61-001000

Datasheet

111 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-628-61-001000

111-93-628-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,936
111-93-628-61-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
36-6503-21

36-6503-21

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

4,618
36-6503-21

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
116-43-640-61-006000

116-43-640-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,281
116-43-640-61-006000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-11-952-41-001000

612-11-952-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,553
612-11-952-41-001000

Datasheet

612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
APH-0524-G-T

APH-0524-G-T

APH-0524-G-T

Samtec Inc.

2,924
APH-0524-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1124-G-T

APH-1124-G-T

APH-1124-G-T

Samtec Inc.

1,962
APH-1124-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1624-G-T

APH-1624-G-T

APH-1624-G-T

Samtec Inc.

4,037
APH-1624-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0724-G-T

APH-0724-G-T

APH-0724-G-T

Samtec Inc.

1,302
APH-0724-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1824-G-T

APH-1824-G-T

APH-1824-G-T

Samtec Inc.

1,397
APH-1824-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1324-G-T

APH-1324-G-T

APH-1324-G-T

Samtec Inc.

2,078
APH-1324-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0824-G-T

APH-0824-G-T

APH-0824-G-T

Samtec Inc.

1,202
APH-0824-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0224-G-T

APH-0224-G-T

APH-0224-G-T

Samtec Inc.

2,776
APH-0224-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1724-G-T

APH-1724-G-T

APH-1724-G-T

Samtec Inc.

1,274
APH-1724-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
323-93-164-41-001000

323-93-164-41-001000

SOCKET 3 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

1,043
323-93-164-41-001000

Datasheet

323 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
28-C300-31

28-C300-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

4,394
28-C300-31

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
121-11-952-41-001000

121-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,839
121-11-952-41-001000

Datasheet

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-93-132-14-071001

510-93-132-14-071001

PGA SOCK 132PIN 14X14 SOLDER TL

Mill-Max Manufacturing Corp.

3,016
510-93-132-14-071001

Datasheet

510 Tube Active PGA 132 (14 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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