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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APH-0624-G-H

APH-0624-G-H

APH-0624-G-H

Samtec Inc.

2,572
APH-0624-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0224-G-H

APH-0224-G-H

APH-0224-G-H

Samtec Inc.

4,423
APH-0224-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1624-G-H

APH-1624-G-H

APH-1624-G-H

Samtec Inc.

1,399
APH-1624-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0724-G-H

APH-0724-G-H

APH-0724-G-H

Samtec Inc.

4,726
APH-0724-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1724-G-H

APH-1724-G-H

APH-1724-G-H

Samtec Inc.

2,433
APH-1724-G-H

Datasheet

* - Active - - - - - - - - - - - - - - -
40-9503-21

40-9503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,989
40-9503-21

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
40-9503-31

40-9503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,644
40-9503-31

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
510-41-144-15-082001

510-41-144-15-082001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

3,254
510-41-144-15-082001

Datasheet

510 Bulk Active PGA 144 (15 x 15) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-652-61-007000

116-43-652-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,340
116-43-652-61-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-93-652-61-007000

116-93-652-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,938
116-93-652-61-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
111-93-964-61-001000

111-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,671
111-93-964-61-001000

Datasheet

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
7100265148

7100265148

TEXTOOLRECEPTACLES FOR DIP SOCKE

3M

4,542
7100265148

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
116-93-648-61-008000

116-93-648-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,697
116-93-648-61-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
122-13-964-41-001000

122-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

1,861
122-13-964-41-001000

Datasheet

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
323-13-164-41-001000

323-13-164-41-001000

SOCKET 3 LEVEL WRAPOST SIP 64POS

Mill-Max Manufacturing Corp.

3,213
323-13-164-41-001000

Datasheet

323 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
517-87-599-54-131111

517-87-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip

1,483
517-87-599-54-131111

Datasheet

517 Bulk Active PGA 599 (54 x 54) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
116-93-642-61-001000

116-93-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,774
116-93-642-61-001000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-6508-212

40-6508-212

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,425
40-6508-212

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
40-6508-312

40-6508-312

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,801
40-6508-312

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-43-950-61-003000

116-43-950-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,730
116-43-950-61-003000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
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