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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
116-93-950-61-003000

116-93-950-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,249
116-93-950-61-003000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-11-964-41-001000

123-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,057
123-11-964-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) - - Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
36-3571-11

36-3571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

1,537
36-3571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3572-11

36-3572-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,513
36-3572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3573-11

36-3573-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

2,958
36-3573-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-3574-11

36-3574-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,248
36-3574-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6571-11

36-6571-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics

1,370
36-6571-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6572-11

36-6572-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,103
36-6572-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6575-11

36-6575-11

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,407
36-6575-11

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
510-93-114-13-062002

510-93-114-13-062002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

1,727
510-93-114-13-062002

Datasheet

510 Bulk Active PGA 114 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-93-114-13-062003

510-93-114-13-062003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,416
510-93-114-13-062003

Datasheet

510 Bulk Active PGA 114 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
32-6508-21

32-6508-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,899
32-6508-21

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
32-6508-31

32-6508-31

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

1,247
32-6508-31

Datasheet

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
546-87-320-19-131147

546-87-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip

1,537
546-87-320-19-131147

Datasheet

546 Bulk Active PGA 320 (19 x 19) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
APH-1834-G-T

APH-1834-G-T

APH-1834-G-T

Samtec Inc.

2,945
APH-1834-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0934-G-T

APH-0934-G-T

APH-0934-G-T

Samtec Inc.

1,114
APH-0934-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1534-G-T

APH-1534-G-T

APH-1534-G-T

Samtec Inc.

3,734
APH-1534-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1934-G-T

APH-1934-G-T

APH-1934-G-T

Samtec Inc.

2,330
APH-1934-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0734-G-T

APH-0734-G-T

APH-0734-G-T

Samtec Inc.

3,448
APH-0734-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0234-G-T

APH-0234-G-T

APH-0234-G-T

Samtec Inc.

1,250
APH-0234-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
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