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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
220-2600-50-0602

220-2600-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 220

3M

4,586
220-2600-50-0602

Datasheet

Textool™ Box Active SIP, ZIF (ZIP) 20 (1 x 20) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
518-77-256M16-000105

518-77-256M16-000105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

2,093
518-77-256M16-000105

Datasheet

518 Bulk Active PGA 256 (16 x 16) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
518-77-256M20-001105

518-77-256M20-001105

CONN SOCKET PGA 256POS GOLD

Preci-Dip

3,704
518-77-256M20-001105

Datasheet

518 Bulk Active PGA 256 (20 x 20) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
514-87-400M20-000148

514-87-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip

3,245
514-87-400M20-000148

Datasheet

514 Bulk Active BGA 400 (20 x 20) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
550-10-292M20-001152

550-10-292M20-001152

BGA SOLDER TAIL

Preci-Dip

4,112
550-10-292M20-001152

Datasheet

550 Bulk Active BGA 292 (20 x 20) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
APH-1136-G-R

APH-1136-G-R

APH-1136-G-R

Samtec Inc.

1,824
APH-1136-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1236-G-R

APH-1236-G-R

APH-1236-G-R

Samtec Inc.

3,784
APH-1236-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1736-G-R

APH-1736-G-R

APH-1736-G-R

Samtec Inc.

4,452
APH-1736-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1336-G-R

APH-1336-G-R

APH-1336-G-R

Samtec Inc.

1,905
APH-1336-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
550-10-420M26-001166

550-10-420M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

3,170
550-10-420M26-001166

Datasheet

550 Bulk Active BGA 420 (26 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
2100-7243-00-1807

2100-7243-00-1807

CONN SOCKET PQFP 100POS TIN-LEAD

3M

1,135
2100-7243-00-1807

Datasheet

OEM Bulk Obsolete QFP 100 (4 x 25) Tin-Lead 200.0µin (5.08µm) Beryllium Copper - Through Hole Open Frame Solder - Tin-Lead 0°C ~ 105°C 200.0µin (5.08µm) Polyethersulfone (PES), Glass Filled Beryllium Copper
614-87-296-19-131144

614-87-296-19-131144

CONN SOCKET PGA 296POS GOLD

Preci-Dip

3,167
614-87-296-19-131144

Datasheet

614 Bulk Active PGA 296 (19 x 19) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
546-87-447-20-121147

546-87-447-20-121147

CONN SOCKET PGA 447POS GOLD

Preci-Dip

3,428
546-87-447-20-121147

Datasheet

546 Bulk Active PGA 447 (20 x 20) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
518-77-255M16-001106

518-77-255M16-001106

CONN SOCKET PGA 255POS GOLD

Preci-Dip

2,642
518-77-255M16-001106

Datasheet

518 Bulk Active PGA 255 (16 x 16) Gold Flash Beryllium Copper 0.050" (1.27mm) Surface Mount Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
239-5605-02-0602

239-5605-02-0602

CONN ZIG-ZAG 39POS GOLD

3M

1,927
239-5605-02-0602

Datasheet

- Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
510-91-324-18-000001

510-91-324-18-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

4,709
510-91-324-18-000001

Datasheet

510 Bulk Active PGA 324 (18 x 18) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
518-77-256M16-000106

518-77-256M16-000106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

4,763
518-77-256M16-000106

Datasheet

518 Bulk Active PGA 256 (16 x 16) Gold Flash Beryllium Copper 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
518-77-256M20-001106

518-77-256M20-001106

CONN SOCKET PGA 256POS GOLD

Preci-Dip

4,689
518-77-256M20-001106

Datasheet

518 Bulk Active PGA 256 (20 x 20) Gold Flash Beryllium Copper 0.050" (1.27mm) Surface Mount Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
64-9503-21

64-9503-21

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

4,157
64-9503-21

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
64-9503-31

64-9503-31

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

1,720
64-9503-31

Datasheet

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
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