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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    APH-1140-G-H

    APH-1140-G-H

    APH-1140-G-H

    Samtec Inc.

    		 4,999
    RFQ Sell Excess Inventory
    		APH-1140-G-H

    Datasheet

         		* - Active - - - - - - - - - - - - - - -
    24-6570-16

    24-6570-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 3,341
    RFQ Sell Excess Inventory
    		24-6570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    24-6571-16

    24-6571-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,706
    RFQ Sell Excess Inventory
    		24-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    24-6573-16

    24-6573-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,510
    RFQ Sell Excess Inventory
    		24-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    546-83-364-17-091147

    546-83-364-17-091147

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    		 3,433
    RFQ Sell Excess Inventory
    		546-83-364-17-091147

    Datasheet

         		546 Bulk Active PGA 364 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
    24-3575-16

    24-3575-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 2,636
    RFQ Sell Excess Inventory
    		24-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-6575-16

    24-6575-16

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 1,880
    RFQ Sell Excess Inventory
    		24-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    HLS-0420-G-19

    HLS-0420-G-19

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,493
    RFQ Sell Excess Inventory
    		HLS-0420-G-19

    Datasheet

         		HLS Bulk Active SIP 80 (4 x 20) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
    510-93-299-20-096002

    510-93-299-20-096002

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,826
    RFQ Sell Excess Inventory
    		510-93-299-20-096002

    Datasheet

         		510 Tube Active PGA 299 (20 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
    518-77-272M20-001106

    518-77-272M20-001106

    CONN SOCKET PGA 272POS GOLD

    Preci-Dip

    		 4,652
    RFQ Sell Excess Inventory
    		518-77-272M20-001106

    Datasheet

         		518 Bulk Active PGA 272 (20 x 20) Gold Flash Beryllium Copper 0.050" (1.27mm) Surface Mount Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
    546-83-365-14-000147

    546-83-365-14-000147

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    		 2,782
    RFQ Sell Excess Inventory
    		546-83-365-14-000147

    Datasheet

         		546 Bulk Active PGA 365 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
    546-83-365-17-091147

    546-83-365-17-091147

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    		 2,955
    RFQ Sell Excess Inventory
    		546-83-365-17-091147

    Datasheet

         		546 Bulk Active PGA 365 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
    514-87-432M31-001148

    514-87-432M31-001148

    CONN SOCKET BGA 432POS GOLD

    Preci-Dip

    		 1,431
    RFQ Sell Excess Inventory
    		514-87-432M31-001148

    Datasheet

         		514 Bulk Active BGA 432 (31 x 31) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
    48-6508-21

    48-6508-21

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 1,289
    RFQ Sell Excess Inventory
    		48-6508-21

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    48-6508-31

    48-6508-31

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 1,151
    RFQ Sell Excess Inventory
    		48-6508-31

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    24-3551-16

    24-3551-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,890
    RFQ Sell Excess Inventory
    		24-3551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3552-16

    24-3552-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 3,998
    RFQ Sell Excess Inventory
    		24-3552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-6551-16

    24-6551-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,318
    RFQ Sell Excess Inventory
    		24-6551-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-6552-16

    24-6552-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 4,597
    RFQ Sell Excess Inventory
    		24-6552-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    24-3553-16

    24-3553-16

    CONN IC DIP SOCKET ZIF 24POS

    Aries Electronics

    		 1,034
    RFQ Sell Excess Inventory
    		24-3553-16

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
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