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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
24-3554-16

24-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

2,377
24-3554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
614-87-320-19-131144

614-87-320-19-131144

CONN SOCKET PGA 320POS GOLD

Preci-Dip

3,785
614-87-320-19-131144

Datasheet

614 Bulk Active PGA 320 (19 x 19) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
614-87-321-19-121144

614-87-321-19-121144

CONN SOCKET PGA 321POS GOLD

Preci-Dip

2,792
614-87-321-19-121144

Datasheet

614 Bulk Active PGA 321 (19 x 19) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
550-10-456M26-001166

550-10-456M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

1,608
550-10-456M26-001166

Datasheet

550 Bulk Active BGA 456 (26 x 26) Gold 10.0µin (0.25µm) Beryllium Copper 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
APH-1940-G-R

APH-1940-G-R

APH-1940-G-R

Samtec Inc.

2,666
APH-1940-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0340-G-R

APH-0340-G-R

APH-0340-G-R

Samtec Inc.

3,504
APH-0340-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1640-G-R

APH-1640-G-R

APH-1640-G-R

Samtec Inc.

4,521
APH-1640-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
614-87-325-18-111144

614-87-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip

3,095
614-87-325-18-111144

Datasheet

614 Bulk Active PGA 325 (18 x 18) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
546-87-296-19-131147

546-87-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

4,913
546-87-296-19-131147

Datasheet

546 Bulk Active PGA 296 (19 x 19) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
546-83-391-18-101147

546-83-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip

2,281
546-83-391-18-101147

Datasheet

546 Bulk Active PGA 391 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
28-6554-16

28-6554-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

3,664
28-6554-16

Datasheet

55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
28-6552-16

28-6552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

2,479
28-6552-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
28-3554-16

28-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

4,404
28-3554-16

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
558-10-292M20-001104

558-10-292M20-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

1,583
558-10-292M20-001104

Datasheet

558 Bulk Active BGA 292 (20 x 20) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
224-5809-50-0602

224-5809-50-0602

3M TEXTOOL ZIP STRIP SOCKETS 224

3M

1,705
224-5809-50-0602

Datasheet

Textool™ Box Active SIP, ZIF (ZIP) 24 (1 x 24) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
APA-648-G-B

APA-648-G-B

ADAPTER PLUG

Samtec Inc.

2,774
APA-648-G-B

Datasheet

APA Bulk Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 20.0µin (0.51µm) Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
239-5605-01-0602

239-5605-01-0602

CONN ZIG-ZAG 39POS GOLD

3M

3,755
239-5605-01-0602

Datasheet

- Bulk Obsolete Zig-Zag 39 (1 x 19, 1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
232-2601-50-0602

232-2601-50-0602

IN-LINE ZIP STRIP POCKETS 32 CON

3M

1,454
232-2601-50-0602

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
518-77-292M20-001105

518-77-292M20-001105

CONN SOCKET PGA 292POS GOLD

Preci-Dip

3,004
518-77-292M20-001105

Datasheet

518 Bulk Active PGA 292 (20 x 20) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
517-83-685-19-000111

517-83-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip

1,660
517-83-685-19-000111

Datasheet

517 Bulk Active PGA 685 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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