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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    44-3575-16

    44-3575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 2,246
    RFQ Sell Excess Inventory
    		44-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    44-6571-16

    44-6571-16

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 1,731
    RFQ Sell Excess Inventory
    		44-6571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    44-6572-16

    44-6572-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 4,919
    RFQ Sell Excess Inventory
    		44-6572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    44-6573-16

    44-6573-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 2,404
    RFQ Sell Excess Inventory
    		44-6573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    44-6574-16

    44-6574-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 4,263
    RFQ Sell Excess Inventory
    		44-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    44-6575-16

    44-6575-16

    CONN IC DIP SOCKET ZIF 44POS TIN

    Aries Electronics

    		 1,102
    RFQ Sell Excess Inventory
    		44-6575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    1011-1-0144-0B-00

    1011-1-0144-0B-00

    TEXTOOL1011-1-0144-0B-00

    3M

    		 3,723
    RFQ Sell Excess Inventory
    		1011-1-0144-0B-00

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    558-10-456M26-001104

    558-10-456M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    		 2,310
    RFQ Sell Excess Inventory
    		558-10-456M26-001104

    Datasheet

         		558 Bulk Active BGA 456 (26 x 26) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
    40-3574-16

    40-3574-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,379
    RFQ Sell Excess Inventory
    		40-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-6574-16

    40-6574-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,968
    RFQ Sell Excess Inventory
    		40-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    40-3570-16

    40-3570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 1,701
    RFQ Sell Excess Inventory
    		40-3570-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    40-3571-16

    40-3571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,603
    RFQ Sell Excess Inventory
    		40-3571-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    40-3572-16

    40-3572-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 4,912
    RFQ Sell Excess Inventory
    		40-3572-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    40-3573-16

    40-3573-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    		 1,751
    RFQ Sell Excess Inventory
    		40-3573-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
    40-3575-16

    40-3575-16

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 1,019
    RFQ Sell Excess Inventory
    		40-3575-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    1017-2-0256-0B-03

    1017-2-0256-0B-03

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    		 2,844
    RFQ Sell Excess Inventory
    		1017-2-0256-0B-03

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    518-77-456M26-001105

    518-77-456M26-001105

    CONN SOCKET PGA 456POS GOLD

    Preci-Dip

    		 2,164
    RFQ Sell Excess Inventory
    		518-77-456M26-001105

    Datasheet

         		518 Bulk Active PGA 456 (26 x 26) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
    48-3574-16

    48-3574-16

    CONN IC DIP SOCKET ZIF 48POS TIN

    Aries Electronics

    		 1,288
    RFQ Sell Excess Inventory
    		48-3574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    48-6574-16

    48-6574-16

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    		 2,949
    RFQ Sell Excess Inventory
    		48-6574-16

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    121-PGM13012-10T

    121-PGM13012-10T

    CONN SOCKET PGA TIN

    Aries Electronics

    		 1,879
    RFQ Sell Excess Inventory
    		121-PGM13012-10T

    Datasheet

         		PGM Bulk Active PGA - Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
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