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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
546-83-296-19-131147

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

2,504
546-83-296-19-131147

Datasheet

546 Bulk Active PGA 296 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bronze
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

2,046
514-83-500M30-001148

Datasheet

514 Bulk Active BGA 500 (30 x 30) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
558-10-420M26-001104

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

1,716
558-10-420M26-001104

Datasheet

558 Bulk Active BGA 420 (26 x 26) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
84-PRS11010-12

84-PRS11010-12

ZIF 11X11 84PIN FOOTPRN 11010

Aries Electronics

1,444
84-PRS11010-12

Datasheet

PRS - Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PLS10003-12

84-PLS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,071
84-PLS10003-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PRS10003-12

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,025
84-PRS10003-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PRS11032-12

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,910
84-PRS11032-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PRS12022-12

84-PRS12022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,477
84-PRS12022-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PRS13053-12

84-PRS13053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,656
84-PRS13053-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
84-PRS13125-12

84-PRS13125-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,848
84-PRS13125-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

1,272
514-83-504M29-001148

Datasheet

514 Bulk Active BGA 504 (29 x 29) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
518-77-420M26-001105

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip

3,816
518-77-420M26-001105

Datasheet

518 Bulk Active PGA 420 (26 x 26) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
514-87-652M35-001148

514-87-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

2,265
514-87-652M35-001148

Datasheet

514 Bulk Active BGA 652 (35 x 35) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
44-3573-16

44-3573-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2,877
44-3573-16

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
550-10-478M26-131152

550-10-478M26-131152

BGA SOLDER TAIL

Preci-Dip

2,590
550-10-478M26-131152

Datasheet

550 Bulk Active BGA 478 (26 x 26) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
HLS-1015-T-12

HLS-1015-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,319
HLS-1015-T-12

Datasheet

HLS Bulk Active SIP 150 (10 x 15) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
550-10-480M29-001152

550-10-480M29-001152

BGA SOLDER TAIL

Preci-Dip

3,828
550-10-480M29-001152

Datasheet

550 Bulk Active BGA 480 (29 x 29) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
18-PRS17041-12

18-PRS17041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,181
18-PRS17041-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
56-PRS15057-12

56-PRS15057-12

ZIF PGA SOCKET 56PIN 15X15

Aries Electronics

4,424
56-PRS15057-12

Datasheet

PRS - Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
56-PLS15057-12

56-PLS15057-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,576
56-PLS15057-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
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