| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-6551-16CONN IC DIP SOCKET ZIF 32POS |
3,573 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
223-83-964-41-101000SKT IC CLOSED |
4,006 |
|
Datasheet |
223 | Bulk | Obsolete | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
518-77-360M19-001106CONN SOCKET PGA 360POS GOLD |
4,309 |
|
Datasheet |
518 | Bulk | Active | PGA | 360 (19 x 19) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
36-6572-16CONN IC DIP SOCKET ZIF 36POS TIN |
4,530 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
290-1294-00-3302JCONN IC DIP SOCKET ZIF 90POS GLD |
4,725 |
|
Datasheet |
Textool™ | Bulk | Active | DIP, ZIF (ZIP) | 90 (2 x 45) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.070" (1.78mm) | Through Hole | Closed Frame | Solder | 0.070" (1.78mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
|
110-33-640-41-530000CONN IC SKT DBL |
1,032 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-33-640-41-101000SOCKET IC CLOSED FRM .600 28POS |
1,988 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
550-10-600M35-001166BGA PIN ADAPTER 1.27MM SMD |
1,845 |
|
Datasheet |
550 | Bulk | Active | BGA | 600 (35 x 35) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
514-87-576M30-001148CONN SOCKET BGA 576POS GOLD |
2,260 |
|
Datasheet |
514 | Bulk | Active | BGA | 576 (30 x 30) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
48-6556-41CONN IC DIP SOCKET 48POS GOLD |
4,768 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
550-10-420M26-001152BGA SOLDER TAIL |
4,059 |
|
Datasheet |
550 | Bulk | Active | BGA | 420 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
40-6554-16CONN IC DIP SOCKET ZIF 40POS |
4,991 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
40-3553-16CONN IC DIP SOCKET ZIF 40POS |
3,780 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
64-9508-21CONN IC DIP SOCKET 64POS GOLD |
2,928 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
64-9508-31CONN IC DIP SOCKET 64POS GOLD |
2,301 |
|
Datasheet |
508 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
169-PGM13001-51CONN SOCKET PGA GOLD |
1,719 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
558-10-400M20-000101PGA SOLDER TAIL 1.27MM |
4,693 |
|
Datasheet |
558 | Bulk | Active | PGA | 400 (20 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
36-3570-16CONN IC DIP SOCKET ZIF 36POS |
1,307 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
210-33-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,458 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
514-83-456M26-001148CONN SOCKET BGA 456POS GOLD |
4,367 |
|
Datasheet |
514 | Bulk | Active | BGA | 456 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
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