| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
32-3572-16CONN IC DIP SOCKET ZIF 32POS |
1,606 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
32-3573-16CONN IC DIP SOCKET ZIF 32POS |
2,341 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
110-83-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,885 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
558-10-356M26-001101PGA SOLDER TAIL 1.27MM |
1,403 |
|
Datasheet |
558 | Bulk | Active | PGA | 356 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
210-33-306-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,360 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Beryllium Copper |
|
|
210-83-422-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,592 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
558-10-357M19-001101PGA SOLDER TAIL 1.27MM |
4,882 |
|
Datasheet |
558 | Bulk | Active | PGA | 357 (19 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
514-87-520M31-001148CONN SOCKET BGA 520POS GOLD |
1,633 |
|
Datasheet |
514 | Bulk | Active | BGA | 520 (31 x 31) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
110-83-640-41-530000CONN IC SKT DBL |
4,519 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
32-6570-16CONN IC DIP SOCKET ZIF 32POS |
4,696 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
32-6571-16CONN IC DIP SOCKET ZIF 32POS |
4,926 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
32-6572-16CONN IC DIP SOCKET ZIF 32POS TIN |
1,542 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
32-6573-16CONN IC DIP SOCKET ZIF 32POS TIN |
3,933 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
110-83-624-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,040 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
223-88-316-41-001000STANDARD WIRE WRAP DIP SOCKET |
1,400 |
|
Datasheet |
223 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Thermoplastic | Beryllium Copper |
|
|
110-88-648-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,881 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
558-10-360M19-001101PGA SOLDER TAIL 1.27MM |
2,207 |
|
Datasheet |
558 | Bulk | Active | PGA | 360 (19 x 19) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
84-PGM13042-10TCONN SOCKET PGA TIN |
2,391 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
210-33-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,337 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
110-33-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,510 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
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