| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-640-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,679 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
100-PRS10001-12CONN SOCKET PGA ZIF GOLD |
1,567 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
40-6556-40CONN IC DIP SOCKET 40POS GOLD |
2,799 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
514-83-420M26-001148CONN SOCKET BGA 420POS GOLD |
4,295 |
|
Datasheet |
514 | Bulk | Active | BGA | 420 (26 x 26) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
550-10-381-18-101135PGA SOLDER TAIL |
4,077 |
|
Datasheet |
550 | Bulk | Active | PGA | 381 (18 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
HLS-0520-T-18.100" SCREW MACHINE SOCKET ARRAY |
2,501 |
|
Datasheet |
HLS | Bulk | Active | SIP | 100 (5 x 20) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 140°C | - | Thermoplastic | - |
|
|
614-83-320-19-131144CONN SOCKET PGA 320POS GOLD |
3,275 |
|
Datasheet |
614 | Bulk | Active | PGA | 320 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
558-10-352M26-001104BGA SURFACE MOUNT 1.27MM |
3,871 |
|
Datasheet |
558 | Bulk | Active | BGA | 352 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
132-PGM13038-50CONN SOCKET PGA GOLD |
4,530 |
|
Datasheet |
PGM | - | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
614-83-321-19-121144CONN SOCKET PGA 321POS GOLD |
2,037 |
|
Datasheet |
614 | Bulk | Active | PGA | 321 (21 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
518-77-352M26-001105CONN SOCKET PGA 352POS GOLD |
3,597 |
|
Datasheet |
518 | Bulk | Active | PGA | 352 (26 x 26) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
110-33-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,876 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
44-536-11CONN SOCKET PLCC ZIF 44POS GOLD |
2,589 |
|
Datasheet |
536 | - | Obsolete | PLCC, ZIF (ZIP) | 44 (4 x 11) | Gold | 12.0µin (0.30µm) | - | 0.050" (1.27mm) | Through Hole | Open Frame | - | - | - | - | - | - | - |
|
|
32-3574-16CONN IC DIP SOCKET ZIF 32POS |
3,316 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
558-10-356M26-001104BGA SURFACE MOUNT 1.27MM |
3,814 |
|
Datasheet |
558 | Bulk | Active | BGA | 356 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
550-10-400M20-000152BGA SOLDER TAIL |
4,121 |
|
Datasheet |
550 | Bulk | Active | BGA | 400 (20 x 20) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
546-83-463-19-101147CONN SOCKET PGA 463POS GOLD |
4,164 |
|
Datasheet |
546 | Bulk | Active | PGA | 463 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
558-10-357M19-001104BGA SURFACE MOUNT 1.27MM |
3,459 |
|
Datasheet |
558 | Bulk | Active | BGA | 357 (19 x 19) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
550-10-576M30-001166BGA PIN ADAPTER 1.27MM SMD |
3,802 |
|
Datasheet |
550 | Bulk | Active | BGA | 576 (30 x 30) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
518-77-356M26-001105CONN SOCKET PGA 356POS GOLD |
3,636 |
|
Datasheet |
518 | Bulk | Active | PGA | 356 (26 x 26) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
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