| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-88-314-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,960 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
110-83-314-41-530000CONN IC DIP SOCKET 14POS GOLD |
4,769 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-88-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,965 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
614-83-296-19-131144CONN SOCKET PGA 296POS GOLD |
2,520 |
|
Datasheet |
614 | Bulk | Active | PGA | 296 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
546-83-419-19-111147CONN SOCKET PGA 419POS GOLD |
1,704 |
|
Datasheet |
546 | Bulk | Active | PGA | 419 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
210-83-306-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,961 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Thermoplastic | Beryllium Copper |
|
|
514-87-504M29-001148CONN SOCKET BGA 504POS GOLD |
1,696 |
|
Datasheet |
514 | Bulk | Active | BGA | 504 (29 x 29) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
546-83-420-19-111147CONN SOCKET PGA 420POS GOLD |
3,595 |
|
Datasheet |
546 | Bulk | Active | PGA | 420 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
110-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,886 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
210-83-308-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,648 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Thermoplastic | Brass |
|
|
510-13-209-17-081002SKT PGA SOLDRTL |
1,581 |
|
Datasheet |
510 | Bulk | Active | PGA | 209 (17 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-88-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,960 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
110-83-320-41-530000CONN IC SKT DBL |
2,061 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-83-320-41-101000CONN IC SKT DBL |
1,423 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-83-624-41-101000CONN IC SKT DBL |
3,932 |
|
Datasheet |
210 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 300.0µin (7.62µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-88-640-41-530000CONN IC SKT DBL |
2,394 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-88-624-41-001000STANDRD SOLDER TAIL DIP SOCKET |
3,175 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
28-536-11CONN SOCKET PLCC ZIF 28POS GOLD |
3,693 |
|
Datasheet |
536 | - | Obsolete | PLCC, ZIF (ZIP) | 28 (4 x 7) | Gold | 12.0µin (0.30µm) | - | 0.050" (1.27mm) | Through Hole | Open Frame | - | - | - | - | - | - | - |
|
|
144-PGM12001-51CONN SOCKET PGA GOLD |
3,940 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
HLS-0420-G-12.100" SCREW MACHINE SOCKET ARRAY |
3,623 |
|
Datasheet |
HLS | Bulk | Active | SIP | 80 (4 x 20) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
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