| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
518-77-357M19-001105CONN SOCKET PGA 357POS GOLD |
1,772 |
|
Datasheet |
518 | Bulk | Active | PGA | 357 (19 x 19) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
110-33-628-41-530000CONN IC DIP SOCKET 28POS GOLD |
4,954 |
|
Datasheet |
110 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-33-628-41-101000SOCKET IC CLOSED FRM .300 28POS |
2,456 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
210-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,417 |
|
Datasheet |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
110-33-316-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,717 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
36-3551-16CONN IC DIP SOCKET ZIF 36POS |
2,335 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 36 (2 x 18) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
558-10-360M19-001104BGA SURFACE MOUNT 1.27MM |
1,525 |
|
Datasheet |
558 | Bulk | Active | BGA | 360 (19 x 19) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
518-77-352M26-001106CONN SOCKET PGA 352POS GOLD |
3,618 |
|
Datasheet |
518 | Bulk | Active | PGA | 352 (26 x 26) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
1109042537 ZIF TEST SCKT LIVE BUG TYPE |
4,517 |
|
Datasheet |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
514-83-432M31-001148CONN SOCKET BGA 432POS GOLD |
2,731 |
|
Datasheet |
514 | Bulk | Active | BGA | 432 (31 x 31) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
518-77-360M19-001105CONN SOCKET PGA 360POS GOLD |
3,105 |
|
Datasheet |
518 | Bulk | Active | PGA | 360 (19 x 19) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
514-87-560M33-001148CONN SOCKET BGA 560POS GOLD |
2,332 |
|
Datasheet |
514 | Bulk | Active | BGA | 560 (33 x 33) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
210-33-320-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,344 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
518-77-356M26-001106CONN SOCKET PGA 356POS GOLD |
2,725 |
|
Datasheet |
518 | Bulk | Active | PGA | 356 (26 x 26) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
281-PGM18037-11CONN SOCKET PGA GOLD |
4,593 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
210-33-632-41-101000CONN IC SKT DBL |
1,790 |
|
Datasheet |
210 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
110-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,173 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
210-33-318-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,494 |
|
Datasheet |
- | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
518-77-357M19-001106CONN SOCKET PGA 357POS GOLD |
2,954 |
|
Datasheet |
518 | Bulk | Active | PGA | 357 (19 x 19) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
558-10-388M26-001101PGA SOLDER TAIL 1.27MM |
4,287 |
|
Datasheet |
558 | Bulk | Active | PGA | 388 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
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