| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
44-6556-40CONN IC DIP SOCKET 44POS GOLD |
2,464 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 44 (2 x 22) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
40-6556-41CONN IC DIP SOCKET 40POS GOLD |
2,220 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
110-33-628-41-001000STANDRD SOLDER TAIL DIP SOCKET |
2,709 |
|
Datasheet |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
210-33-628-41-001000STANDRD SOLDER TAIL DIP SOCKET |
1,884 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
550-10-432M31-001152BGA SOLDER TAIL |
4,295 |
|
Datasheet |
550 | Bulk | Active | BGA | 432 (31 x 31) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
32-3575-16CONN IC DIP SOCKET ZIF 32POS |
2,825 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
179-PGM15011-10HCONN SOCKET PGA GOLD |
4,238 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
558-10-388M26-001104BGA SURFACE MOUNT 1.27MM |
3,716 |
|
Datasheet |
558 | Bulk | Active | BGA | 388 (26 x 26) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
514-87-600M35-001148CONN SOCKET BGA 600POS GOLD |
4,867 |
|
Datasheet |
514 | Bulk | Active | BGA | 600 (35 x 35) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
518-77-388M26-001105CONN SOCKET PGA 388POS GOLD |
4,189 |
|
Datasheet |
518 | Bulk | Active | PGA | 388 (26 x 26) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
32-6575-16CONN IC DIP SOCKET ZIF 32POS TIN |
1,342 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
HLS-1012-G-10.100" SCREW MACHINE SOCKET ARRAY |
1,145 |
|
Datasheet |
HLS | Bulk | Active | SIP | 120 (10 x 12) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 140°C | 10.0µin (0.25µm) | Thermoplastic | - |
|
|
210-33-632-41-001000STANDRD SOLDER TAIL DIP SOCKET |
4,701 |
|
Datasheet |
210 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Brass |
|
|
48-6556-40CONN IC DIP SOCKET 48POS GOLD |
3,067 |
|
Datasheet |
6556 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder Cup | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
|
546-83-503-22-131147CONN SOCKET PGA 503POS GOLD |
4,234 |
|
Datasheet |
546 | Bulk | Active | PGA | 503 (22 x 22) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Bronze |
|
|
40-6570-16CONN IC DIP SOCKET ZIF 40POS |
2,971 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
40-6571-16CONN IC DIP SOCKET ZIF 40POS |
1,153 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
40-6572-16CONN IC DIP SOCKET ZIF 40POS TIN |
3,854 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
40-6573-16CONN IC DIP SOCKET ZIF 40POS TIN |
2,810 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
40-6575-16CONN IC DIP SOCKET ZIF 40POS TIN |
1,488 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
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