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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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100-028-000CONN IC DIP SOCKET 28POS GOLD |
3,881 |
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Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
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100-028-001CONN IC DIP SOCKET 28POS GOLD |
3,369 |
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Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
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100-032-000CONN IC DIP SOCKET 32POS GOLD |
4,201 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
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100-032-001CONN IC DIP SOCKET 32POS GOLD |
1,897 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
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100-040-000CONN IC DIP SOCKET 40POS GOLD |
3,886 |
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Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
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100-040-001CONN IC DIP SOCKET 40POS GOLD |
4,736 |
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Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Seal Tape | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
|
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100-042-000CONN IC DIP SOCKET 42POS GOLD |
3,025 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
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100-048-000CONN IC DIP SOCKET 48POS GOLD |
3,915 |
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Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 8.00µin (0.203µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | Flash | Polyphenylene Sulfide (PPS), Glass Filled | Brass |
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2-382462-1CONN IC DIP SOCKET 8POS TIN |
1,503 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Beryllium Copper |
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2-643574-4CONN IC DIP SOCKET 48POS GOLD |
2,771 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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382437-3CONN SOCKET SIP 3POS TIN |
4,344 |
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Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 3 (1 x 3) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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7-1437539-2CONN IC DIP SOCKET 24POS TIN |
4,409 |
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Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
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1825375-3CONN IC DIP SOCKET 40POS GOLD |
4,015 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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1825375-2CONN IC DIP SOCKET 28POS GOLD |
1,848 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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1-390261-1CONN IC DIP SOCKET 6POS TIN |
4,195 |
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Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | - | Phosphor Bronze |
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1-822473-2CONN SOCKET PLCC 28POS TIN |
2,430 |
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Datasheet |
- | Box | Obsolete | PLCC | 28 (4 x 7) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 80.0µin (2.03µm) | Thermoplastic | Phosphor Bronze |
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8058-1G57CONN TRANSIST TO-5 8POS GOLD |
2,568 |
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Datasheet |
8058 | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Brass |
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2-1437530-9CONN SOCKET SIP 12POS |
4,550 |
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Datasheet |
500 | Bulk | Active | SIP | 12 (1 x 12) | - | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | Beryllium Copper |
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816-AG10D-ESCONN IC DIP SOCKET 16POS GOLD |
2,046 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | Copper Alloy |
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816-AG11D-ESL-LFCONN IC DIP SOCKET 16POS GOLD |
3,581 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
