Upload
IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
4607CONN TRANSIST TO-3 3POS TIN |
1,514 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
|
4609CONN TRANSIST TO-3 3POS TIN |
4,373 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
|
822114-3CONN SOCKET PQFP 144POS TIN-LEAD |
4,323 |
|
Datasheet |
- | Tube | Obsolete | QFP | 144 (4 x 36) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
|
382437-1CONN SOCKET SIP 3POS TIN |
3,497 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 3 (1 x 3) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
643644-1CONN SOCKET SIP 12POS TIN |
3,516 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643654-1CONN SOCKET SIP 22POS TIN |
2,089 |
|
Datasheet |
Diplomate DL | Tray | Active | SIP | 22 (1 x 22) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
|
232-1297-00-3303CONN IC DIP SOCKET ZIF 32POS GLD |
2,897 |
|
Datasheet |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 250.0µin (6.35µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 250.0µin (6.35µm) | Polyether Imide (PEI), Glass Filled | Beryllium Copper |
|
|
4618CONN TRANSIST TO-3 3POS TIN |
3,219 |
|
Datasheet |
- | Bulk | Active | Transistor, TO-3 | 3 (Rectangular) | Tin | - | Brass | - | Chassis Mount | Closed Frame | Solder | - | Tin | - | - | Polyester, Glass Filled | Brass |
|
|
101-93-314-41-560000CONN IC DIP SOCKET 14POS GOLD |
2,403 |
|
Datasheet |
101 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
101-93-640-41-560000CONN IC DIP SOCKET 40POS GOLD |
1,359 |
|
Datasheet |
101 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
518-93-391-18-096002CONN SOCKET PGA 391POS GOLD |
2,586 |
|
Datasheet |
518 | Tube | Active | PGA | 391 (18 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
|
518-93-447-20-116002SOCKET INTERSTITIAL 447-PGA |
3,852 |
|
Datasheet |
518 | Bulk | Active | PGA | 447 (20 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
1825093-2CONN IC DIP SOCKET 8POS GOLD |
2,505 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
A-CCS-044-Z-SM-RCONN SOCKET PLCC 44POS TIN |
3,968 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
A-CCS68-Z-SM-RCONN SOCKET PLCC 68POS TIN |
3,328 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 105°C | 150.0µin (3.81µm) | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
|
940-44-052-17-400000CONN SOCKET PLCC 52POS TIN |
3,735 |
|
Datasheet |
940 | Tube | Discontinued | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
1-390261-9CONN IC DIP SOCKET 28POS TIN |
3,692 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 60.0µin (1.52µm) | - | Phosphor Bronze |
|
1-822473-4CONN SOCKET PLCC 44POS TIN |
2,257 |
|
Datasheet |
- | Box | Obsolete | PLCC | 44 (4 x 11) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | Phosphor Bronze |
|
1825093-3CONN IC DIP SOCKET 14POS GOLD |
3,209 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
1825093-4CONN IC DIP SOCKET 16POS GOLD |
4,276 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
