| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
382444-2CONN SOCKET SIP 8POS TIN-LEAD |
4,985 |
|
Datasheet |
- | Tube | Obsolete | SIP | 8 (1 x 8) | Tin-Lead | 150.0µin (3.81µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | 150.0µin (3.81µm) | Fluoropolymer (FP) | Beryllium Copper |
|
382444-3CONN SOCKET SIP 10POS TIN-LEAD |
1,370 |
|
Datasheet |
- | Tube | Active | SIP | 10 (1 x 10) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | 150.0µin (3.81µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
|
643641-6CONN SOCKET SIP 9POS TIN |
2,898 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 9 (1 x 9) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643644-3CONN SOCKET SIP 12POS TIN |
1,378 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
643646-1CONN SOCKET SIP 14POS TIN |
1,199 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 14 (1 x 14) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643646-3CONN SOCKET SIP 14POS TIN |
4,859 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 14 (1 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
643646-6CONN SOCKET SIP 14POS TIN |
3,701 |
|
Datasheet |
Diplomate DL | Tray | Active | SIP | 14 (1 x 14) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643650-1CONN SOCKET SIP 18POS TIN |
2,929 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 18 (1 x 18) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643652-1CONN SOCKET SIP 20POS TIN |
2,539 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643652-6CONN SOCKET SIP 20POS TIN |
2,912 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 20 (1 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643657-1CONN SOCKET SIP 25POS TIN |
1,942 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 25 (1 x 25) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643640-1CONN SOCKET SIP 8POS TIN |
3,975 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 8 (1 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
643642-1CONN SOCKET SIP 10POS TIN |
1,049 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
|
821949-4CONN SOCKET PQFP 100POS TIN-LEAD |
4,322 |
|
Datasheet |
- | Tube | Obsolete | QFP | 100 (4 x 25) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
|
822114-4CONN SOCKET PQFP 160POS TIN-LEAD |
1,464 |
|
Datasheet |
- | Tube | Obsolete | QFP | 160 (4 x 40) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin-Lead | - | 200.0µin (5.08µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
|
2-644018-2CONN IC DIP SOCKET 32POS GOLD |
1,354 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Beryllium Copper |
|
2-641932-4CONN IC DIP SOCKET 24POS GOLD |
1,379 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic | Phosphor Bronze |
|
2-641933-1CONN IC DIP SOCKET 24POS TIN |
1,833 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Beryllium Copper |
|
|
2-644018-4CONN IC DIP SOCKET 32POS GOLD |
4,028 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic | Phosphor Bronze |
|
2-641615-3CONN IC DIP SOCKET 28POS TIN |
1,643 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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