| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
523-93-068-10-041001PGA SOCK 68PIN 10X10 WIRE WRAP |
3,224 |
|
Datasheet |
523 | Bulk | Active | PGA | 68 (10 x 10) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
523-93-068-11-061001PGA SOCK 68PIN 11X11 WIRE WRAP |
3,878 |
|
Datasheet |
523 | Bulk | Active | PGA | 68 (11 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
523-93-101-13-061001PGA SOCK 101PIN 13X13 WIRE WRAP |
4,722 |
|
Datasheet |
523 | Bulk | Active | PGA | 101 (13 x 13) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
523-93-132-14-071001PGA SOCK 132PIN 14X14 WIRE WRAP |
2,976 |
|
Datasheet |
523 | Bulk | Active | PGA | 132 (14 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
523-93-088-13-081001PGA SOCK 88PIN 13X13 WIRE WRAP |
3,712 |
|
Datasheet |
523 | Bulk | Active | PGA | 88 (13 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
|
523-93-084-10-031001PGA SOCK 84PIN 10X10 WIRE WRAP |
4,635 |
|
Datasheet |
523 | Bulk | Active | PGA | 84 (10 x 10) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
523-13-132-13-041001PGA SOCKET 13X13 132 PINS |
3,037 |
|
Datasheet |
523 | Bulk | Active | PGA | 132 (13 x 13) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | - | 10.0µin (0.25µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
216-6278-00-3303CONN IC DIP SOCKET ZIF 16POS GLD |
4,280 |
|
Datasheet |
OEM | Tube | Obsolete | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 250.0µin (6.35µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 250.0µin (6.35µm) | Polyether Imide (PEI), Glass Filled | Beryllium Copper |
|
523-93-169-17-101002PGA SOCK 169 PIN 17X17 WIRE WD |
3,291 |
|
Datasheet |
523 | Bulk | Active | PGA | 169 (17 x 17) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin-Lead | - | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - |
|
2-382467-3CONN IC DIP SOCKET 28POS TIN |
2,613 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Phosphor Bronze |
|
2-382470-3CONN IC DIP SOCKET 32POS TIN |
2,195 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Thermoplastic | Phosphor Bronze |
|
2-382568-8CONN IC DIP SOCKET 28POS TIN |
2,135 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
2-641264-4CONN IC DIP SOCKET 20POS GOLD |
3,089 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
2-641268-4CONN IC DIP SOCKET 40POS GOLD |
4,044 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
2-641604-2CONN IC DIP SOCKET 24POS GOLD |
1,952 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Beryllium Copper |
|
|
2-641606-4CONN IC DIP SOCKET 40POS GOLD |
4,630 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
2-641616-2CONN IC DIP SOCKET 40POS GOLD |
4,292 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic | Beryllium Copper |
|
382438-1CONN SOCKET SIP 4POS TIN |
2,571 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 4 (1 x 4) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
382441-1CONN SOCKET SIP 7POS TIN |
2,979 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 7 (1 x 7) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
|
382444-1CONN SOCKET SIP 6POS TIN-LEAD |
2,184 |
|
Datasheet |
- | Tube | Active | SIP | 6 (1 x 6) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | 150.0µin (3.81µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |