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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    40-6553-18

    40-6553-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,464
    RFQ Sell Excess Inventory
    		40-6553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    7100265144

    7100265144

    TEXTOOLTEST AND BURN-IN BALL GRI

    3M

    		 1,126
    RFQ Sell Excess Inventory
    		7100265144

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    361-PLS19001-12

    361-PLS19001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 2,240
    RFQ Sell Excess Inventory
    		361-PLS19001-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    7010293840

    7010293840

    TEXTOOL1021-2-0400-0B-00L36=1.0M

    3M

    		 2,824
    RFQ Sell Excess Inventory
    		7010293840

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    200-6325-9UN-1900

    200-6325-9UN-1900

    CONN SOCKET PGA ZIF 625POS GOLD

    3M

    		 2,398
    RFQ Sell Excess Inventory
    		200-6325-9UN-1900

    Datasheet

         		Textool™ Bulk Obsolete PGA, ZIF (ZIP) 625 (25 x 25) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polyethersulfone (PES) Beryllium Copper
    336-PLS20019-12

    336-PLS20019-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 2,521
    RFQ Sell Excess Inventory
    		336-PLS20019-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    336-PLS20021-12

    336-PLS20021-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 4,411
    RFQ Sell Excess Inventory
    		336-PLS20021-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    336-PRS20019-12

    336-PRS20019-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 1,494
    RFQ Sell Excess Inventory
    		336-PRS20019-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    336-PRS20021-12

    336-PRS20021-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 1,236
    RFQ Sell Excess Inventory
    		336-PRS20021-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    42-3551-18

    42-3551-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 4,698
    RFQ Sell Excess Inventory
    		42-3551-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    42-3552-18

    42-3552-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 2,784
    RFQ Sell Excess Inventory
    		42-3552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    42-3553-18

    42-3553-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 2,826
    RFQ Sell Excess Inventory
    		42-3553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    42-6552-18

    42-6552-18

    CONN IC DIP SOCKET ZIF 42POS

    Aries Electronics

    		 4,776
    RFQ Sell Excess Inventory
    		42-6552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-3575-18

    36-3575-18

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 2,406
    RFQ Sell Excess Inventory
    		36-3575-18

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    336-PLS21022-12

    336-PLS21022-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 4,701
    RFQ Sell Excess Inventory
    		336-PLS21022-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    7100285425

    7100285425

    TEXTOOLTEST & BURN-IN BALL GRID

    3M

    		 3,289
    RFQ Sell Excess Inventory
    		7100285425

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    7010297751

    7010297751

    TEXTOOL1019-1-0484-0B-02L25

    3M

    		 1,342
    RFQ Sell Excess Inventory
    		7010297751

    Datasheet

         		- Bulk Active - - - - - - - - - - - - - - -
    42-3574-18

    42-3574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 3,843
    RFQ Sell Excess Inventory
    		42-3574-18

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-3575-18

    42-3575-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,189
    RFQ Sell Excess Inventory
    		42-3575-18

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    42-6574-18

    42-6574-18

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 2,416
    RFQ Sell Excess Inventory
    		42-6574-18

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
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