| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
257-PLS20012-12CONN SOCKET PGA ZIF GOLD |
1,124 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
257-PLS20018-12CONN SOCKET PGA ZIF GOLD |
2,192 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
257-PRS20012-12CONN SOCKET PGA ZIF GOLD |
2,588 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
71002651453M TEXTOOLTEST & BURN-IN BALL GR |
1,366 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
324-PLS18001-12CONN SOCKET PGA ZIF GOLD |
2,066 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
324-PRS18001-12CONN SOCKET PGA ZIF GOLD |
1,233 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
1027-2-0416-0B-00TEXTOOL1027-2-0416-0B-00 1.0MM O |
2,965 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
48-3551-18CONN IC DIP SOCKET ZIF 48POS |
2,129 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
48-3552-18CONN IC DIP SOCKET ZIF 48POS |
4,749 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
48-6552-18CONN IC DIP SOCKET ZIF 48POS |
4,358 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
48-6553-18CONN IC DIP SOCKET ZIF 48POS |
2,545 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
48-3554-18CONN IC DIP SOCKET ZIF 48POS |
2,651 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
48-6554-18CONN IC DIP SOCKET ZIF 48POS |
4,620 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
7000090518TEXTOOLBURN-IN GRID ZIP SOCKETS |
2,148 |
|
Datasheet |
Textool™ | Bulk | Active | PGA, ZIF (ZIP) | 169 (13 x 13) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 150°C | 30.0µin (0.76µm) | Polyethersulfone (PES) | Beryllium Copper |
|
|
1027-2-0516-0B-00TEXTOOL1027-2-0516-0B-00 |
3,879 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
40-3551-18CONN IC DIP SOCKET ZIF 40POS |
3,951 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
40-3552-18CONN IC DIP SOCKET ZIF 40POS |
3,121 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
40-3553-18CONN IC DIP SOCKET ZIF 40POS |
2,752 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
40-6551-18CONN IC DIP SOCKET ZIF 40POS |
3,397 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
40-6552-18CONN IC DIP SOCKET ZIF 40POS |
3,731 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
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