OEM STOCKUpload
    Hot Search CR2032 SR920SW AD620ARZ-REEL S912XET256BMAL LM3480IM3X-12 SA571DR2G STM32F030F4P6 TPS62242DRVR LM358D LM3489MMX
    OEM STOCK OEM STOCK OEM STOCK
    All Categories
    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    Apply All
    Reset All
    Result
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    2528-1361-SB-3302

    2528-1361-SB-3302

    3M TEXTOOL TEST & BURN-IN SPGA S

    3M

    		 1,433
    RFQ Sell Excess Inventory
    		2528-1361-SB-3302

    Datasheet

         		Textool™ Box Obsolete - - - - - - - - - - - - - - -
    210-PRS19034-12

    210-PRS19034-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 1,215
    RFQ Sell Excess Inventory
    		210-PRS19034-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    44-3551-18

    44-3551-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 4,778
    RFQ Sell Excess Inventory
    		44-3551-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-3552-18

    44-3552-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 3,247
    RFQ Sell Excess Inventory
    		44-3552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-3553-18

    44-3553-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 4,898
    RFQ Sell Excess Inventory
    		44-3553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-6551-18

    44-6551-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 1,753
    RFQ Sell Excess Inventory
    		44-6551-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-6552-18

    44-6552-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 1,070
    RFQ Sell Excess Inventory
    		44-6552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-6553-18

    44-6553-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 3,092
    RFQ Sell Excess Inventory
    		44-6553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-3554-18

    44-3554-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 3,249
    RFQ Sell Excess Inventory
    		44-3554-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    44-6554-18

    44-6554-18

    CONN IC DIP SOCKET ZIF 44POS

    Aries Electronics

    		 1,972
    RFQ Sell Excess Inventory
    		44-6554-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-6552-18

    36-6552-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 3,112
    RFQ Sell Excess Inventory
    		36-6552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-6553-18

    36-6553-18

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    		 4,645
    RFQ Sell Excess Inventory
    		36-6553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
    36-6554-18

    36-6554-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 4,891
    RFQ Sell Excess Inventory
    		36-6554-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-3551-18

    36-3551-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 1,519
    RFQ Sell Excess Inventory
    		36-3551-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-3552-18

    36-3552-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 3,924
    RFQ Sell Excess Inventory
    		36-3552-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-3553-18

    36-3553-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 2,063
    RFQ Sell Excess Inventory
    		36-3553-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    36-3554-18

    36-3554-18

    CONN IC DIP SOCKET ZIF 36POS

    Aries Electronics

    		 1,543
    RFQ Sell Excess Inventory
    		36-3554-18

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
    300-PLS20006-12

    300-PLS20006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 4,526
    RFQ Sell Excess Inventory
    		300-PLS20006-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    300-PRS20006-12

    300-PRS20006-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 1,002
    RFQ Sell Excess Inventory
    		300-PRS20006-12

    Datasheet

         		PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    299-PLS20009-12

    299-PLS20009-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 2,434
    RFQ Sell Excess Inventory
    		299-PLS20009-12

    Datasheet

         		PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
    Total 19086 Record«Prev1... 910911912913914915916917...955Next»
    Search Product

    Search

     Product Category

    Products

     Tel Us

    Phone

     My Acccout

    User
    OEM STOCK
    OEM STOCK
    [email protected]