| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
7100286975TEXTOOLBURN-IN GRID ZIP SOCKETS |
4,382 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
162-PLS20020-12CONN SOCKET PGA ZIF GOLD |
4,381 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
162-PRS20020-12CONN SOCKET PGA ZIF GOLD |
3,760 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
558-10-652M35-001104BGA SURFACE MOUNT 1.27MM |
4,659 |
|
Datasheet |
558 | Bulk | Active | BGA | 652 (35 x 35) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
164-PRS21013-12CONN SOCKET PGA ZIF GOLD |
3,013 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
518-77-652M35-001105CONN SOCKET PGA 652POS GOLD |
4,088 |
|
Datasheet |
518 | Bulk | Active | PGA | 652 (35 x 35) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
1019-2-0324-0B-01TEXTOOLTEST & BURN-IN BALL GRID |
2,403 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
168-PRS17011-12CONN SOCKET PGA ZIF GOLD |
2,752 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
172-PRS16002-12CONN SOCKET PGA ZIF GOLD |
1,552 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
225-PLS18003-12ZIF PGA SOCKET 225 PIN 18 X 18 |
2,503 |
|
Datasheet |
PLS | - | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
518-77-652M35-001106CONN SOCKET PGA 652POS GOLD |
2,859 |
|
Datasheet |
518 | Bulk | Active | PGA | 652 (35 x 35) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
289-PLS17001-12CONN SOCKET PGA ZIF GOLD |
1,787 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
260-5204-01CONN SOCKET QFN 60POS GOLD |
3,357 |
|
Datasheet |
Textool™ | Bulk | Active | QFN | 60 (4 x 15) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Through Hole | Open Frame | Solder | 0.020" (0.50mm) | Gold | - | - | Polyethersulfone (PES) | Beryllium Copper |
|
|
175-PRS16005-12CONN SOCKET PGA ZIF GOLD |
2,427 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
28-3552-18CONN IC DIP SOCKET ZIF 28POS |
1,065 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
28-3553-18CONN IC DIP SOCKET ZIF 28POS |
1,042 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
28-6551-18CONN IC DIP SOCKET ZIF 28POS |
1,016 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
28-6552-18CONN IC DIP SOCKET ZIF 28POS |
4,957 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
28-6553-18CONN IC DIP SOCKET ZIF 32POS TIN |
4,736 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
28-3554-18CONN IC DIP SOCKET ZIF 24POS |
3,808 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
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