| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
518-77-520M31-001106CONN SOCKET PGA 520POS GOLD |
4,968 |
|
Datasheet |
518 | Bulk | Active | PGA | 520 (31 x 31) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
105-PLS17055-12CONN SOCKET PGA ZIF GOLD |
2,874 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
105-PRS17054-12CONN SOCKET PGA ZIF GOLD |
2,467 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
550-10-600M35-001152BGA SOLDER TAIL |
2,713 |
|
Datasheet |
550 | Bulk | Active | BGA | 600 (35 x 35) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
191-PGM18015-10TCONN SOCKET PGA TIN |
1,165 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | 200.0µin (5.08µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
64-PLS16016-12CONN SOCKET PGA ZIF GOLD |
4,689 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
101-PRS14030-12CONN SOCKET PGA ZIF GOLD |
2,947 |
|
Datasheet |
PRS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
558-10-576M30-001101PGA SOLDER TAIL 1.27MM |
3,671 |
|
Datasheet |
558 | Bulk | Active | PGA | 576 (30 x 30) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
514-83-652M35-001148CONN SOCKET BGA 652POS GOLD |
4,512 |
|
Datasheet |
514 | Bulk | Active | BGA | 652 (35 x 35) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
28-3551-18CONN IC DIP SOCKET ZIF 28POS |
2,547 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
234-3034-02-0602CONN ZIG-ZAG ZIF 34POS GOLD |
2,202 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
|
24-6574-18CONN IC DIP SOCKET ZIF 24POS TIN |
2,370 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
558-10-560M33-001104BGA SURFACE MOUNT 1.27MM |
4,243 |
|
Datasheet |
558 | Bulk | Active | BGA | 560 (33 x 33) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
518-77-560M33-001105CONN SOCKET PGA 560POS GOLD |
1,108 |
|
Datasheet |
518 | Bulk | Active | PGA | 560 (33 x 33) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
558-10-600M35-001101PGA SOLDER TAIL 1.27MM |
3,809 |
|
Datasheet |
558 | Bulk | Active | PGA | 600 (35 x 35) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
168-PLS17011-12CONN SOCKET PGA ZIF GOLD |
2,721 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
172-PLS16002-12CONN SOCKET PGA ZIF GOLD |
1,177 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
|
|
24-6570-18CONN IC DIP SOCKET ZIF 24POS |
4,726 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
7010402515TEXTOOL1017-2-0252-0B-00L20 PP15 |
3,099 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
518-77-560M33-001106CONN SOCKET PGA 560POS GOLD |
4,318 |
|
Datasheet |
518 | Bulk | Active | PGA | 560 (33 x 33) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Surface Mount | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
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