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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
121-PLS13121-12

121-PLS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,293
121-PLS13121-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
121-PRS13121-12

121-PRS13121-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,511
121-PRS13121-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
80-PRS21027-12

80-PRS21027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,676
80-PRS21027-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
558-10-576M30-001104

558-10-576M30-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

3,848
558-10-576M30-001104

Datasheet

558 Bulk Active BGA 576 (30 x 30) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
132-PLS14016-12

132-PLS14016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,211
132-PLS14016-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
518-77-576M30-001105

518-77-576M30-001105

CONN SOCKET PGA 576POS GOLD

Preci-Dip

1,514
518-77-576M30-001105

Datasheet

518 Bulk Active PGA 576 (30 x 30) Gold Flash Beryllium Copper 0.050" (1.27mm) Through Hole Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
1017-2-0256-0B-01

1017-2-0256-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

2,936
1017-2-0256-0B-01

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
550-10-652M35-001152

550-10-652M35-001152

BGA SOLDER TAIL

Preci-Dip

1,140
550-10-652M35-001152

Datasheet

550 Bulk Active BGA 652 (35 x 35) Gold 10.0µin (0.25µm) Brass 0.050" (1.27mm) Through Hole Closed Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) FR4 Epoxy Glass Brass
200-6321-9UN-1900

200-6321-9UN-1900

CONN SOCKET PGA ZIF 441POS GOLD

3M

2,570
200-6321-9UN-1900

Datasheet

Textool™ Bulk Obsolete PGA, ZIF (ZIP) 441 (21 x 21) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polyethersulfone (PES) Beryllium Copper
100-PLS17048-12

100-PLS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,893
100-PLS17048-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
100-PLS17049-12

100-PLS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,044
100-PLS17049-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
100-PRS17048-12

100-PRS17048-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,543
100-PRS17048-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
100-PRS17049-12

100-PRS17049-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,582
100-PRS17049-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
235-3019-02-0602

235-3019-02-0602

CONN ZIG-ZAG ZIF 35POS GOLD

3M

4,282
235-3019-02-0602

Datasheet

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 35 (1 x 17, 1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polysulfone (PSU), Glass Filled Beryllium Copper
24-3575-18

24-3575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

4,662
24-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
24-6575-18

24-6575-18

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

1,468
24-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
518-77-576M30-001106

518-77-576M30-001106

CONN SOCKET PGA 576POS GOLD

Preci-Dip

4,354
518-77-576M30-001106

Datasheet

518 Bulk Active PGA 576 (30 x 30) Gold Flash Beryllium Copper 0.050" (1.27mm) Surface Mount Open Frame Solder 0.050" (1.27mm) Gold -55°C ~ 125°C Flash FR4 Epoxy Glass Brass
144-PLS15026-12

144-PLS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,368
144-PLS15026-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
144-PRS15026-12

144-PRS15026-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,776
144-PRS15026-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
145-PRS15058-12

145-PRS15058-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,776
145-PRS15058-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
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