| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
175-PGM16003-11CONN SOCKET PGA GOLD |
3,444 |
|
Datasheet |
PGM | Bulk | Active | PGA | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
|
|
234-3034-01-0602CONN ZIG-ZAG ZIF 34POS GOLD |
1,601 |
|
Datasheet |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 34 (1 x 34) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polysulfone (PSU), Glass Filled | Beryllium Copper |
|
|
42-6574-16CONN IC DIP SOCKET ZIF 42POS TIN |
4,673 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Tin | 200.0µin (5.08µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper |
|
|
42-3572-16CONN IC DIP SOCKET ZIF 42POS |
1,562 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
42-6571-16CONN IC DIP SOCKET ZIF 42POS |
4,794 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | - | 50.0µin (1.27µm) | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Nickel |
|
|
550-10-560M33-001152BGA SOLDER TAIL |
2,285 |
|
Datasheet |
550 | Bulk | Active | BGA | 560 (33 x 33) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
7100285426TEXTOOLBURN-IN GRID ZIP SOCKETS |
4,041 |
|
Datasheet |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
24-3552-18CONN IC DIP SOCKET ZIF 24POS |
4,353 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-3553-18CONN IC DIP SOCKET ZIF 24POS |
4,643 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-6551-18CONN IC DIP SOCKET ZIF 24POS |
1,156 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-6552-18CONN IC DIP SOCKET ZIF 24POS |
2,852 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-6553-18CONN IC DIP SOCKET ZIF 24POS |
1,793 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-3554-18CONN IC DIP SOCKET ZIF 24POS |
3,410 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
24-6554-18CONN IC DIP SOCKET ZIF 24POS |
2,672 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | -55°C ~ 250°C | 50.0µin (1.27µm) | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel |
|
|
558-10-500M30-001104BGA SURFACE MOUNT 1.27MM |
2,131 |
|
Datasheet |
558 | Bulk | Active | BGA | 500 (30 x 30) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
514-83-600M35-001148CONN SOCKET BGA 600POS GOLD |
1,640 |
|
Datasheet |
514 | Bulk | Active | BGA | 600 (35 x 35) | Gold | 29.5µin (0.75µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | Brass |
|
|
518-77-500M30-001105CONN SOCKET PGA 500POS GOLD |
4,804 |
|
Datasheet |
518 | Bulk | Active | PGA | 500 (30 x 30) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
558-10-504M29-001104BGA SURFACE MOUNT 1.27MM |
2,104 |
|
Datasheet |
558 | Bulk | Active | BGA | 504 (29 x 29) | Gold | 10.0µin (0.25µm) | Brass | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | 10.0µin (0.25µm) | FR4 Epoxy Glass | Brass |
|
|
518-77-504M29-001105CONN SOCKET PGA 504POS GOLD |
3,107 |
|
Datasheet |
518 | Bulk | Active | PGA | 504 (29 x 29) | Gold | Flash | Beryllium Copper | 0.050" (1.27mm) | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | -55°C ~ 125°C | Flash | FR4 Epoxy Glass | Brass |
|
|
108-PLS12024-12CONN SOCKET PGA ZIF GOLD |
4,222 |
|
Datasheet |
PLS | Bulk | Active | PGA, ZIF (ZIP) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -65°C ~ 125°C | 200.0µin (5.08µm) | Polyphenylene Sulfide (PPS) | Beryllium Copper |
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