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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
7100148803

7100148803

TEXTOOL1012-0-0289-0B-00L20 0.65

3M

3,832
7100148803

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
192-PRS17027-12

192-PRS17027-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,737
192-PRS17027-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
7010402522

7010402522

TEXTOOLTEST & BURN-IN SOCKETS PL

3M

1,189
7010402522

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
244-5205-00

244-5205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

4,734
244-5205-00

Datasheet

Textool™ Box Active - - - - - - - - - - - - - - -
216-PRS21016-12

216-PRS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,102
216-PRS21016-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
208-PLS17017-12

208-PLS17017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,312
208-PLS17017-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
32-3574-18

32-3574-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,253
32-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
32-6574-18

32-6574-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,329
32-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
209-PRS17030-12

209-PRS17030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,889
209-PRS17030-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
209-PRS17046-12

209-PRS17046-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,456
209-PRS17046-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
176-PRS15014-12

176-PRS15014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,615
176-PRS15014-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
280-PLS19006-12

280-PLS19006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,707
280-PLS19006-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
280-PRS19006-12

280-PRS19006-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,690
280-PRS19006-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PRS19012-12

281-PRS19012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,330
281-PRS19012-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
179-PLS18038-12

179-PLS18038-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,581
179-PLS18038-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
179-PRS18038-12

179-PRS18038-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,913
179-PRS18038-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PRS18037-12

281-PRS18037-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,825
281-PRS18037-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
32-3575-18

32-3575-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

1,386
32-3575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron - 50.0µin (1.27µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Nickel
32-6575-18

32-6575-18

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

2,456
32-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
180-PLS18007-12

180-PLS18007-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,122
180-PLS18007-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
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