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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
181-PLS18041-12

181-PLS18041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,243
181-PLS18041-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
181-PRS18040-12

181-PRS18040-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,848
181-PRS18040-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
181-PRS18041-12

181-PRS18041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,511
181-PRS18041-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
40-6554-18

40-6554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,012
40-6554-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
40-3554-18

40-3554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

1,528
40-3554-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
196-PRS14001-16

196-PRS14001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,606
196-PRS14001-16

Datasheet

PRS Bulk Obsolete PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze -65°C ~ 200°C 50.0µin (1.27µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PRS19010-12

281-PRS19010-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,443
281-PRS19010-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PLS19029-12

281-PLS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,401
281-PLS19029-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PRS19029-12

281-PRS19029-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,675
281-PRS19029-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
229-PLS16014-12

229-PLS16014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,173
229-PLS16014-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
229-PRS16014-12

229-PRS16014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,842
229-PRS16014-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
264-4205-00

264-4205-00

3M TEXTOOL OPEN-TOP SOCKETS FOR

3M

1,692
264-4205-00

Datasheet

Textool™ Box Active - - - - - - - - - - - - - - -
208-PRS17017-12

208-PRS17017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,932
208-PRS17017-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
28-6554-18

28-6554-18

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

4,586
28-6554-18

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron -55°C ~ 250°C 50.0µin (1.27µm) Polyetheretherketone (PEEK), Glass Filled Beryllium Nickel
256-PRS16001-12

256-PRS16001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,133
256-PRS16001-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
257-PRS21011-12

257-PRS21011-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,907
257-PRS21011-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
257-PRS21015-12

257-PRS21015-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,139
257-PRS21015-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
257-PRS20018-12

257-PRS20018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,975
257-PRS20018-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
262-PLS20003-12

262-PLS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,458
262-PLS20003-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
262-PRS20003-12

262-PRS20003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,363
262-PRS20003-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
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