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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
299-PRS20009-12

299-PRS20009-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,164
299-PRS20009-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
225-PRS15001-16

225-PRS15001-16

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,520
225-PRS15001-16

Datasheet

PRS Bulk Obsolete PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Bronze -65°C ~ 200°C 50.0µin (1.27µm) Polyphenylene Sulfide (PPS) Beryllium Copper
1023-2-0324-0B-01

1023-2-0324-0B-01

TEXTOOLTEST & BURN-IN BALL GRID

3M

1,108
1023-2-0324-0B-01

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
256-5205-01

256-5205-01

3M TEXTOOL 256-5205-01 QFN .5 MM

3M

2,980
256-5205-01

Datasheet

Textool™ Bulk Active - - - - - - - - - - - - - - -
268-4204-00

268-4204-00

3M TEXTOOL 268-4204-00 QFN.4 MM

3M

2,578
268-4204-00

Datasheet

Textool™ Bulk Active - - - - - - - - - - - - - - -
216-PLS21016-12

216-PLS21016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,949
216-PLS21016-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
7100236450

7100236450

TEXTOOLTEST & BURN-IN BALL GRID

3M

2,011
7100236450

Datasheet

- Bulk Active - - - - - - - - - - - - - - -
36-3574-18

36-3574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,208
36-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6574-18

36-6574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,006
36-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
36-6575-18

36-6575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

4,409
36-6575-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
336-PRS21022-12

336-PRS21022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,025
336-PRS21022-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
281-PLS19012-12

281-PLS19012-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,899
281-PLS19012-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
240-PRS20014-12

240-PRS20014-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,420
240-PRS20014-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
40-3574-18

40-3574-18

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

4,405
40-3574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
40-6574-18

40-6574-18

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

1,764
40-6574-18

Datasheet

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Beryllium Copper
273-PRS21004-12

273-PRS21004-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,608
273-PRS21004-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
7100265147

7100265147

TEXTOOLBURN-IN GRID ZIP SOCKETS

3M

2,746
7100265147

Datasheet

Textool™ Bulk Active PGA, ZIF (ZIP) 132 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 150°C 30.0µin (0.76µm) Polyethersulfone (PES) Beryllium Copper
256-PRS20005-12

256-PRS20005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,909
256-PRS20005-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
257-PLS20013-12

257-PLS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

3,307
257-PLS20013-12

Datasheet

PLS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
257-PRS20013-12

257-PRS20013-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

4,809
257-PRS20013-12

Datasheet

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -65°C ~ 125°C 200.0µin (5.08µm) Polyphenylene Sulfide (PPS) Beryllium Copper
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