IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
DIP316-011BLF

DIP316-011BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

3,029
DIP316-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP324-011BLF

DIP324-011BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

4,497
DIP324-011BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP1X20-001BLF

SIP1X20-001BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

4,397
SIP1X20-001BLF

Datasheet

SIP1x Bulk Obsolete SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
DIP314-001BLF

DIP314-001BLF

CONN IC DIP SOCKET 14POS GOLD

Amphenol ICC (FCI)

3,497
DIP314-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP324-001BLF

DIP324-001BLF

CONN IC DIP SOCKET 24POS GOLD

Amphenol ICC (FCI)

3,294
DIP324-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP316-001BLF

DIP316-001BLF

CONN IC DIP SOCKET 16POS GOLD

Amphenol ICC (FCI)

4,980
DIP316-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP316-014BLF

DIP316-014BLF

CONN IC DIP SOCKET 16POS TIN

Amphenol ICC (FCI)

2,017
DIP316-014BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X04-157BLF

SIP050-1X04-157BLF

CONN SOCKET SIP 4POS TIN

Amphenol ICC (FCI)

2,144
SIP050-1X04-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 4 (1 x 4) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X27-157BLF

SIP050-1X27-157BLF

CONN SOCKET SIP 27POS TIN

Amphenol ICC (FCI)

3,672
SIP050-1X27-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 27 (1 x 27) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP1X20-041BLF

SIP1X20-041BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

2,930
SIP1X20-041BLF

Datasheet

SIP1x Bulk Obsolete SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
DIP628-014BLF

DIP628-014BLF

CONN IC DIP SOCKET 28POS TIN

Amphenol ICC (FCI)

2,631
DIP628-014BLF

Datasheet

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 100.0µin (2.54µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X18-157BLF

SIP050-1X18-157BLF

CONN SOCKET SIP 18POS TIN

Amphenol ICC (FCI)

3,369
SIP050-1X18-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 18 (1 x 18) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
DIP306-001BLF

DIP306-001BLF

CONN IC DIP SOCKET 6POS GOLD

Amphenol ICC (FCI)

3,949
DIP306-001BLF

Datasheet

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X02-157BLF

SIP050-1X02-157BLF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)

4,640
SIP050-1X02-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X04-160BLF

SIP050-1X04-160BLF

CONN SOCKET SIP 4POS GOLD

Amphenol ICC (FCI)

2,353
SIP050-1X04-160BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X14-160BLF

SIP050-1X14-160BLF

CONN SOCKET SIP 14POS GOLD

Amphenol ICC (FCI)

4,845
SIP050-1X14-160BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 14 (1 x 14) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP1X32-041BLF

SIP1X32-041BLF

CONN SOCKET SIP 32POS GOLD

Amphenol ICC (FCI)

4,166
SIP1X32-041BLF

Datasheet

SIP1x Bulk Obsolete SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyphenylene Sulfide (PPS), Glass Filled Brass
SIP050-1X05-157BLF

SIP050-1X05-157BLF

CONN SOCKET SIP 5POS TIN

Amphenol ICC (FCI)

1,296
SIP050-1X05-157BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 5 (1 x 5) Tin 200.0µin (5.08µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X20-160BLF

SIP050-1X20-160BLF

CONN SOCKET SIP 20POS GOLD

Amphenol ICC (FCI)

4,982
SIP050-1X20-160BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
SIP050-1X02-160BLF

SIP050-1X02-160BLF

1X02-160BLF SIP SOCKET 2 CTS

Amphenol ICC (FCI)

4,024
SIP050-1X02-160BLF

Datasheet

SIP050-1x Bulk Obsolete SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
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