Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































Apply All
Reset All
Result
Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
18-0503-30

18-0503-30

CONN SOCKET SIP 18POS GOLD

Aries Electronics

1,242
18-0503-30

Datasheet

0503 Bulk Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA), Nylon, Glass Filled Brass
16-3508-201

16-3508-201

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,566
16-3508-201

Datasheet

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
116-93-304-41-008000

116-93-304-41-008000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

3,101
116-93-304-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-43-304-41-008000

116-43-304-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,810
116-43-304-41-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0306-T-18

HLS-0306-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,749
HLS-0306-T-18

Datasheet

HLS Tube Active SIP 18 (3 x 6) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) - -55°C ~ 140°C - Thermoplastic -
614-43-640-31-012000

614-43-640-31-012000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

3,312
614-43-640-31-012000

Datasheet

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
116-83-650-41-001101

116-83-650-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

3,315
116-83-650-41-001101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
4-1437531-1

4-1437531-1

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

1,638
4-1437531-1

Datasheet

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - Copper Alloy 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C - - Copper Alloy
ICF-322-SM-O

ICF-322-SM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,247
ICF-322-SM-O

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
ICF-322-S-I

ICF-322-S-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

4,320
ICF-322-S-I

Datasheet

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
510-83-132-13-002101

510-83-132-13-002101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

4,860
510-83-132-13-002101

Datasheet

510 Bulk Active PGA 132 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-132-13-042101

510-83-132-13-042101

CONN SOCKET PGA 132POS GOLD

Preci-Dip

2,339
510-83-132-13-042101

Datasheet

510 Bulk Active PGA 132 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
APA-320-T-P

APA-320-T-P

ADAPTER PLUG

Samtec Inc.

4,119
APA-320-T-P

Datasheet

APA Tube Active - 20 (2 x 10) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
18-3518-01

18-3518-01

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

4,576
18-3518-01

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
16-822-90

16-822-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,524
16-822-90

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
24-0517-90C

24-0517-90C

CONN SOCKET SIP 24POS GOLD

Aries Electronics

4,891
24-0517-90C

Datasheet

0517 Bulk Active SIP 24 (1 x 24) Gold 30.0µin (0.76µm) Beryllium Copper - Through Hole, Right Angle - Solder - Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
510-87-241-18-071101

510-87-241-18-071101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

2,886
510-87-241-18-071101

Datasheet

510 Bulk Active PGA 241 (18 x 18) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-87-241-18-072101

510-87-241-18-072101

CONN SOCKET PGA 241POS GOLD

Preci-Dip

2,758
510-87-241-18-072101

Datasheet

510 Bulk Active PGA 241 (18 x 18) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
514-87-078-13-061117

514-87-078-13-061117

CONN SOCKET PGA 78POS GOLD

Preci-Dip

4,132
514-87-078-13-061117

Datasheet

514 Bulk Active PGA 78 (13 x 13) Gold Flash Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
ICA-624-ZWGT-3

ICA-624-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

3,387
ICA-624-ZWGT-3

Datasheet

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 10.0µin (0.25µm) Polyester, Glass Filled Brass
Total 19086 Record«Prev1... 372373374375376377378379...955Next»

Frequently Asked Questions

IC Sockets Overview

Search Product

Search

Product Category

Products

Tel Us

Phone

My Acccout

User

OEM STOCK
OEM STOCK
[email protected]