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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
APA-314-T-B

APA-314-T-B

ADAPTER PLUG

Samtec Inc.

4,091
APA-314-T-B

Datasheet

APA Bulk Active - 14 (2 x 7) Tin - Phosphor Bronze 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin - - Polybutylene Terephthalate (PBT), Glass Filled Phosphor Bronze
121-13-304-41-001000

121-13-304-41-001000

CONN IC DIP SOCKET 4POS GOLD

Mill-Max Manufacturing Corp.

4,862
121-13-304-41-001000

Datasheet

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
08-6503-21

08-6503-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,038
08-6503-21

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
08-6503-31

08-6503-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

3,605
08-6503-31

Datasheet

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
24-6513-10H

24-6513-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

3,912
24-6513-10H

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
346-93-129-41-013000

346-93-129-41-013000

CONN SOCKET SIP 29POS GOLD

Mill-Max Manufacturing Corp.

3,746
346-93-129-41-013000

Datasheet

346 Bulk Active SIP 29 (1 x 29) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
346-43-129-41-013000

346-43-129-41-013000

CONN SOCKET SIP 29POS GOLD

Mill-Max Manufacturing Corp.

1,992
346-43-129-41-013000

Datasheet

346 Bulk Active SIP 29 (1 x 29) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Press-Fit 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
40-6513-11

40-6513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,722
40-6513-11

Datasheet

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
ICA-320-ZSGG

ICA-320-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,635
ICA-320-ZSGG

Datasheet

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
37-0518-11H

37-0518-11H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

2,010
37-0518-11H

Datasheet

518 Bulk Active SIP 37 (1 x 37) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
14-810-90RWR

14-810-90RWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

4,146
14-810-90RWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 50.0µin (1.27µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin - 50.0µin (1.27µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
ICA-422-SGG-L

ICA-422-SGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

1,699
ICA-422-SGG-L

Datasheet

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold -55°C ~ 125°C 30.0µin (0.76µm) Polyester, Glass Filled Brass
116-83-636-41-004101

116-83-636-41-004101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

3,056
116-83-636-41-004101

Datasheet

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
28-3518-111

28-3518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

1,186
28-3518-111

Datasheet

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
28-6518-111

28-6518-111

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,763
28-6518-111

Datasheet

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
510-87-225-15-000101

510-87-225-15-000101

CONN SOCKET PGA 225POS GOLD

Preci-Dip

2,255
510-87-225-15-000101

Datasheet

510 Bulk Active PGA 225 (15 x 15) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
APO-422-T-J

APO-422-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

2,986
APO-422-T-J

Datasheet

* - Active - - - - - - - - - - - - - - -
HLS-0209-G-11

HLS-0209-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,166
HLS-0209-G-11

Datasheet

HLS Tube Active SIP 18 (2 x 9) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
HLS-0308-G-2

HLS-0308-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

1,872
HLS-0308-G-2

Datasheet

HLS Tube Active SIP 24 (3 x 8) Gold 30.0µin (0.76µm) - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 140°C 10.0µin (0.25µm) Thermoplastic -
12-0503-21

12-0503-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,865
12-0503-21

Datasheet

0503 Bulk Active SIP 12 (1 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole - Wire Wrap 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA), Nylon, Glass Filled Brass
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