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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
14-822-90TWR

14-822-90TWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

3,540
14-822-90TWR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
14-823-90WR

14-823-90WR

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

2,540
14-823-90WR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
16-820-90WR

16-820-90WR

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

1,081
16-820-90WR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
614-43-304-41-001000

614-43-304-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,786
614-43-304-41-001000

Datasheet

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0312-TT-30

HLS-0312-TT-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

3,684
HLS-0312-TT-30

Datasheet

HLS Tube Active SIP 36 (3 x 12) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 140°C - Thermoplastic -
612-41-304-41-004000

612-41-304-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,066
612-41-304-41-004000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-91-304-41-004000

612-91-304-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,277
612-91-304-41-004000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
HLS-0320-TT-2

HLS-0320-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

2,187
HLS-0320-TT-2

Datasheet

HLS Tube Active SIP 60 (3 x 20) Tin - - 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -55°C ~ 140°C - Thermoplastic -
20-822-90E

20-822-90E

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

4,106
20-822-90E

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 50.0µin (1.27µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - 50.0µin (1.27µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
123-91-304-41-001000

123-91-304-41-001000

SOCKET IC OPEN 3 LVL .300 4POS

Mill-Max Manufacturing Corp.

4,970
123-91-304-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-41-304-41-001000

123-41-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,531
123-41-304-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
510-83-133-13-001101

510-83-133-13-001101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

1,744
510-83-133-13-001101

Datasheet

510 Bulk Active PGA 133 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
510-83-133-13-043101

510-83-133-13-043101

CONN SOCKET PGA 133POS GOLD

Preci-Dip

1,129
510-83-133-13-043101

Datasheet

510 Bulk Active PGA 133 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Brass
123-13-624-41-001000

123-13-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

3,413
123-13-624-41-001000

Datasheet

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
123-13-324-41-001000

123-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

4,679
123-13-324-41-001000

Datasheet

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold -55°C ~ 125°C 10.0µin (0.25µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
16-3503-30

16-3503-30

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

4,154
16-3503-30

Datasheet

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin -55°C ~ 105°C 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Phosphor Bronze
ICF-640-STL-I-TR

ICF-640-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

1,736
ICF-640-STL-I-TR

Datasheet

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper 0.100" (2.54mm) Surface Mount Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C - Liquid Crystal Polymer (LCP) Beryllium Copper
612-93-304-41-001000

612-93-304-41-001000

SOCKET CARRIER SLDRTL .300 4POS

Mill-Max Manufacturing Corp.

3,219
612-93-304-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
612-43-304-41-001000

612-43-304-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,886
612-43-304-41-001000

Datasheet

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin -55°C ~ 125°C 200.0µin (5.08µm) Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Brass Alloy
08-2810-90WR

08-2810-90WR

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

2,775
08-2810-90WR

Datasheet

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze 0.100" (2.54mm) Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Gold - 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6 Phosphor Bronze
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