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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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4-1437531-5CONN IC DIP SOCKET 16POS GOLD |
192 |
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Datasheet |
500 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | - | Copper Alloy |
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514-AG10DCONN IC DIP SOCKET 14POS GOLD |
4,602 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | - | Copper Alloy |
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2-1571550-6CONN IC DIP SOCKET 20POS GOLD |
3,343 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
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540-AG10D-ESCONN IC DIP SOCKET 40POS GOLD |
1,909 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | - | Brass |
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7-1437536-3540-AG10D-ES=SOCKET ASSY |
4,246 |
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Datasheet |
* | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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ICA-314-WTT-3.100" SCREW MACHINE DIP SOCKET |
2,518 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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ICO-628-STT.100" LOW PROFILE SCREW MACHINE |
1,863 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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820-AG10DCONN IC DIP SOCKET 20POS GOLD |
4,763 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 105°C | - | Polyester | - |
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ICF-320-T-O.100" SURFACE MOUNT SCREW MACHIN |
1,225 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICA-318-SST.100" SCREW MACHINE DIP SOCKET |
2,836 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polyester, Glass Filled | Brass |
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ICO-308-SGG.100" LOW PROFILE SCREW MACHINE |
1,505 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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ICF-320-T-O-TR.100" SURFACE MOUNT SCREW MACHIN |
2,017 |
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Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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506-AG10DCONN IC DIP SOCKET 6POS GOLD |
4,572 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | - | Brass |
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3-1571586-6CONN IC DIP SOCKET 24POS GOLD |
3,808 |
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Datasheet |
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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ICF-308-S-I.100" SURFACE MOUNT SCREW MACHIN |
4,325 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICO-314-ZSGT.100" LOW PROFILE SCREW MACHINE |
1,201 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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APA-624-T-A1ADAPTER PLUG |
4,032 |
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Datasheet |
APA | Bulk | Active | - | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICF-308-SM-O-TR.100" SURFACE MOUNT SCREW MACHIN |
3,556 |
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Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICF-308-S-I-TR.100" SURFACE MOUNT SCREW MACHIN |
4,686 |
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Datasheet |
ICF | Tape & Reel (TR) | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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614-43-324-31-012000CONN IC DIP SOCKET 24POS GOLD |
201 |
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Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 200.0µin (5.08µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Brass Alloy |
