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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICO-324-NTT.100" LOW PROFILE SCREW MACHINE |
4,680 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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ICO-640-STT.100" LOW PROFILE SCREW MACHINE |
1,261 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polyester, Glass Filled | Brass |
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ICO-314-MGT.100" LOW PROFILE SCREW MACHINE |
3,265 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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2134928-1CONN SOCKET LGA 1150POS GOLD |
3,543 |
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Datasheet |
- | Tray | Active | LGA | 1150 | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.036" (0.91mm) | Surface Mount | Closed Frame | Solder | 0.036" (0.91mm) | - | - | - | Thermoplastic | - |
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APO-624-T-H.100" LOW PROFILE SCREW MACHINE |
2,921 |
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Datasheet |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Polybutylene Terephthalate (PBT), Glass Filled | Phosphor Bronze |
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ICO-320-MGT.100" LOW PROFILE SCREW MACHINE |
2,978 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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ICA-308-ZAGG.100" SCREW MACHINE DIP SOCKET |
1,128 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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ICF-640-T-O.100" SURFACE MOUNT SCREW MACHIN |
3,704 |
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Datasheet |
ICF | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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8080-1G1CONN TRANSIST TO-3 4POS GOLD |
183 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 4 (Round) | Tin-Lead | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | - | Fluoropolymer (FP) | Beryllium Copper |
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ICF-318-S-I.100" SURFACE MOUNT SCREW MACHIN |
2,138 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICF-318-S-O.100" SURFACE MOUNT SCREW MACHIN |
2,579 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICA-314-ZAGG.100" SCREW MACHINE DIP SOCKET |
1,480 |
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Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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ICA-632-SGTCONN IC DIP SOCKET 32POS GOLD |
2,664 |
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Datasheet |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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ICO-632-SGT100" LOW PROFILE SCREW MACHINE D |
3,880 |
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Datasheet |
ICO | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 10.0µin (0.25µm) | Polyester, Glass Filled | Brass |
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12-8473-310CCONN IC DIP SOCKET 12POS GOLD |
165 |
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Datasheet |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 10.0µin (0.25µm) | Polyamide (PA46), Nylon 4/6, Glass Filled | Brass |
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6-6437504-2CONN TRANSIST TO-3 3POS SILVER |
2,411 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | - | Beryllium Copper | - | Chassis Mount | Closed Frame | Solder | - | Silver | -55°C ~ 125°C | - | Diallyl Phthalate (DAP) | Beryllium Copper |
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ICF-320-S-O.100" SURFACE MOUNT SCREW MACHIN |
3,413 |
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Datasheet |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Liquid Crystal Polymer (LCP) | Beryllium Copper |
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ICO-314-NGG.100" LOW PROFILE SCREW MACHINE |
4,834 |
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Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Polyester, Glass Filled | Brass |
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ICA-640-SST.100" SCREW MACHINE DIP SOCKET |
4,930 |
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Datasheet |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | - | Polyester, Glass Filled | Brass |
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8080-1G15CONN TRANSIST TO-3 3POS TIN-LEAD |
1,148 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | - | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | 200.0µin (5.08µm) | Fluoropolymer (FP) | Beryllium Copper |
