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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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69802-120LFCONN SOCKET PLCC 20POS TIN |
1,845 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 150.0µin (3.81µm) | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
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69802-168LFCONN SOCKET PLCC 68POS TIN |
1,245 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | 0.050" (1.27mm) | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | -55°C ~ 125°C | 150.0µin (3.81µm) | Polyphenylene Sulfide (PPS) | Phosphor Bronze |
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814-AG11D-ESL-LFCONN IC DIP SOCKET 14POS GOLD |
3,692 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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828-AG11D-ESL-LFCONN IC DIP SOCKET 28POS GOLD |
1,725 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
|
4-1571552-4CONN IC DIP SOCKET 16POS GOLD |
4,548 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
|
4-1571552-9CONN IC DIP SOCKET 28POS GOLD |
4,565 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
|
1-822473-5CONN SOCKET PLCC 52POS TIN |
4,181 |
|
Datasheet |
- | Box | Obsolete | PLCC | 52 (4 x 13) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 100.0µin (2.54µm) | Thermoplastic | Phosphor Bronze |
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5-1571552-2CONN IC DIP SOCKET 40POS GOLD |
2,212 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 20.0µin (0.51µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
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808-AG11D-ES-LFCONN IC DIP SOCKET 8POS GOLD |
1,519 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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2-1571586-9CONN IC DIP SOCKET 28POS GOLD |
3,956 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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508-AG10DCONN IC DIP SOCKET 8POS GOLD |
2,227 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | - | Copper Alloy |
|
516-AG10DCONN IC DIP SOCKET 16POS GOLD |
2,265 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | -55°C ~ 125°C | - | - | Brass |
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2-641616-1CONN IC DIP SOCKET 40POS TIN |
3,643 |
|
Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Beryllium Copper |
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5-1571551-0CONN IC DIP SOCKET 32POS GOLD |
2,423 |
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Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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5-1571551-2CONN IC DIP SOCKET 40POS GOLD |
4,187 |
|
Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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4-1571551-4CONN IC DIP SOCKET 16POS GOLD |
4,664 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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1-1571994-0CONN SOCKET SIP 10POS GOLD |
1,760 |
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Datasheet |
510 | Tube | Obsolete | SIP | 10 (1 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 20.0µin (0.51µm) | Thermoplastic, Polyester | Copper |
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643648-3CONN SOCKET SIP 16POS TIN |
1,809 |
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Datasheet |
Diplomate DL | Box | Obsolete | SIP | 16 (1 x 16) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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1825373-4CONN IC DIP SOCKET 16POS GOLD |
2,764 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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2-641611-1CONN IC DIP SOCKET 18POS TIN |
3,396 |
|
Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic | Beryllium Copper |
