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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1825094-3CONN IC DIP SOCKET 14POS GOLD |
3,689 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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8060-1G7CONN TRANSIST TO-5 3POS GOLD |
3,256 |
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Datasheet |
8060 | Bulk | Active | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polytetrafluoroethylene (PTFE) | Beryllium Copper |
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2-1571994-0CONN SOCKET SIP 20POS GOLD |
4,214 |
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Datasheet |
510 | Tube | Obsolete | SIP | 20 (1 x 20) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 20.0µin (0.51µm) | Thermoplastic, Polyester | Copper |
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1825374-3CONN IC DIP SOCKET 14POS GOLD |
2,304 |
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Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 15.0µin (0.38µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
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1-822473-1CONN SOCKET PLCC 20POS TIN |
1,878 |
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Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | 100.0µin (2.54µm) | Thermoplastic | Phosphor Bronze |
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2-382713-1CONN IC DIP SOCKET 18POS TIN |
1,477 |
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Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
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2-382718-8CONN IC DIP SOCKET 28POS TIN |
4,752 |
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Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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2-382724-1CONN IC DIP SOCKET 40POS TIN |
2,328 |
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Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
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1571550-7CONN IC DIP SOCKET 22POS TIN |
4,387 |
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Datasheet |
500 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
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2-1571550-7CONN IC DIP SOCKET 22POS GOLD |
1,952 |
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Datasheet |
500 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
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3-1571550-0CONN IC DIP SOCKET 32POS GOLD |
3,597 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
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3-1571550-1CONN IC DIP SOCKET 36POS GOLD |
3,132 |
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Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 25.0µin (0.63µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 25.0µin (0.63µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Beryllium Copper |
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506-AG11D-ESL-LFCONN IC DIP SOCKET 6POS GOLD |
3,870 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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3-1571551-0CONN IC DIP SOCKET 32POS GOLD |
4,953 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | Flash | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Nickel |
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5-1571552-1CONN IC DIP SOCKET 36POS GOLD |
4,157 |
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Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 20.0µin (0.51µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 105°C | 20.0µin (0.51µm) | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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824-AG32D-LFCONN IC DIP SOCKET 24POS TIN |
4,927 |
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Datasheet |
800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Copper |
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1-1825108-3CONN IC DIP SOCKET 40POS GOLD |
3,162 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Beryllium Copper |
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3-1825276-2CONN IC DIP SOCKET 32POS GOLD |
4,031 |
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Datasheet |
Diplomate DL | Tray | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Beryllium Copper |
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643645-3CONN SOCKET SIP 13POS TIN |
1,670 |
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Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 13 (1 x 13) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Phosphor Bronze |
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510-AG90D-10CONN SOCKET SIP 10POS GOLD |
3,256 |
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Datasheet |
500 | Tube | Obsolete | SIP | 10 (1 x 10) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | - | - | Thermoplastic | Beryllium Copper |
