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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1939416-1CONN SOCKET LGA 1207POS GOLD |
2,670 |
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Datasheet |
- | Tray | Active | LGA | 1207 (33 x 34) | Gold | - | Beryllium Copper | 0.043" (1.09mm) | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | -55°C ~ 110°C | - | Thermoplastic | - |
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516-AG7DCONN IC DIP SOCKET 16POS GOLD |
4,174 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | Polyester | Copper Alloy |
|
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1939416-2CONN SOCKET LGA 1207POS GOLD |
3,860 |
|
Datasheet |
- | Tray | Active | LGA | 1207 (33 x 34) | Gold | - | Beryllium Copper | 0.043" (1.09mm) | Surface Mount | Closed Frame | Solder | 0.043" (1.09mm) | - | -55°C ~ 110°C | - | Thermoplastic | - |
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2-641262-4CONN IC DIP SOCKET 16POS GOLD |
1,781 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Phosphor Bronze |
|
1-1437538-3CONN IC DIP SOCKET 28POS TINLEAD |
4,327 |
|
Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin-Lead | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
|
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1554116-2CONN SOCKET LGA 1356POS GOLD |
3,289 |
|
Datasheet |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | -25°C ~ 100°C | 15.0µin (0.38µm) | Thermoplastic | Copper Alloy |
|
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1554116-3CONN SOCKET LGA 1356POS GOLD |
2,464 |
|
Datasheet |
- | Tray | Obsolete | LGA | 1356 (32 x 41) | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | Gold | -25°C ~ 100°C | 30.0µin (0.76µm) | Thermoplastic | Copper Alloy |
|
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1761122-1POWER ASSY |
1,456 |
|
Datasheet |
- | Bulk | Active | LGA | 145 | Gold | 30.0µin (0.76µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | - | 30.0µin (0.76µm) | Thermoplastic, Glass Filled | Copper Alloy |
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1939737-1CONN SOCKET LGA 1366POS |
2,886 |
|
Datasheet |
- | Tray | Obsolete | LGA | 1366 (32 x 41) | - | - | - | - | - | - | - | - | - | - | - | - | - |
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8059-2G2CONN TRANSIST TO-5 3POS GOLD |
1,063 |
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Datasheet |
8059 | Bulk | Obsolete | Transistor, TO-5 | 3 (Round) | Gold | - | Copper Alloy | - | Through Hole | - | Solder | - | Gold | -55°C ~ 125°C | - | Polyamide (PA), Nylon | Copper Alloy |
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5-1437530-2CONN IC SIP SOCKET 8POS GOLD |
3,660 |
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Datasheet |
500 | Tube | Obsolete | SIP | 8 (1 x 8) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | - | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | - | Polyester | Brass |
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528-AG11DCONN IC DIP SOCKET 28POS GOLD |
2,110 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
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808-AG12DCONN IC DIP SOCKET 8POS TIN-LEAD |
2,571 |
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Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin-Lead | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
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506-AG11D-ESCONN IC DIP SOCKET 6POS GOLD |
1,526 |
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Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Copper Alloy |
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2-382468-4CONN IC DIP SOCKET 40POS GOLD |
2,915 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | - | Thermoplastic | Phosphor Bronze |
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2-382712-1CONN IC DIP SOCKET 16POS TIN |
4,999 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
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8080-1G7CONN TRANSIST TO-3 4POS GOLD |
3,251 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 4 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Fluoropolymer (FP) | Beryllium Copper |
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822064-5CONN SOCKET PQFP 132POS TIN-LEAD |
4,256 |
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Datasheet |
- | Tube | Active | QFP | 132 (4 x 33) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | 0.025" (0.64mm) | Through Hole | Closed Frame | Solder | 0.025" (0.64mm) | Tin-Lead | - | 200.0µin (5.08µm) | Liquid Crystal Polymer (LCP) | Phosphor Bronze |
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1814655-7CONN SOCKET SIP 10POS GOLD |
2,529 |
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Datasheet |
- | Bulk | Obsolete | SIP | 10 (1 x 10) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Thermoplastic, Polyester | Brass |
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2-382719-1CONN IC DIP SOCKET 30POS TIN |
2,876 |
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Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 30 (2 x 15) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 105°C | - | Thermoplastic, Glass Filled | Beryllium Copper |
