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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Mating | Mounting Style | Features | Termination | Pitch - Post | Contact Finish - Post | Operating Temperature | Contact Finish Thickness - Post | Housing Material | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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54020-84030LFCONN SOCKET PLCC 84POS TIN |
3,683 |
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Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | 100.0µin (2.54µm) | Copper Alloy | 0.050" (1.27mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | -40°C ~ 105°C | 100.0µin (2.54µm) | Polyphenylene Sulfide (PPS) | Copper Alloy |
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2040636-1CONN SOCKET LGA 1567POS GOLD |
1,929 |
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Datasheet |
- | Tray | Obsolete | LGA | 1567 | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.040" (1.02mm) | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | - | Thermoplastic | Copper Alloy |
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2-210715-1CONN SOCKET PGA 241POS GOLD |
1,597 |
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Datasheet |
PKA | Bulk | Active | PGA | 241 (18 x 18) | Gold | 10.0µin (0.25µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | - | 118.1µin (3.00µm) | Thermoplastic, Polyester, Glass Filled | Phosphor Bronze |
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210715-4CONN SOCKET PGA 241POS GOLD |
1,198 |
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Datasheet |
PKA | Bulk | Active | PGA | 241 (18 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | - | 118.1µin (3.00µm) | Thermoplastic, Polyester, Glass Filled | Phosphor Bronze |
|
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210796-4CONN SOCKET PGA 144POS GOLD |
4,200 |
|
Datasheet |
FCM | Tube | Active | PGA | 144 (15 x 15) | Gold | 30.0µin (0.76µm) | - | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | 196.9µin (5.00µm) | - | - |
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210218-4CONN SOCKET PGA 181POS GOLD |
4,408 |
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Datasheet |
- | Tube | Active | PGA | 181 (15 x 15) | Gold | 30.0µin (0.76µm) | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin-Lead | - | 118.1µin (3.00µm) | Thermoplastic, Polyester, Glass Filled | Phosphor Bronze |
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2287402-1CONN SOCKET LGA 1151POS GOLD |
4,441 |
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Datasheet |
- | Bulk | Obsolete | LGA | 1151 | Gold | 15.0µin (0.38µm) | Copper Alloy | 0.036" (0.91mm) | Surface Mount | Closed Frame | Solder | 0.036" (0.91mm) | Gold | - | 15.0µin (0.38µm) | Thermoplastic | Copper Alloy |
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1825575-2CONN IC DIP SOCKET 8POS TIN |
3,979 |
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Datasheet |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 196.9µin (5.00µm) | Beryllium Copper | 0.100" (2.54mm) | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | -55°C ~ 125°C | 196.9µin (5.00µm) | Thermoplastic, Polyester | Brass |
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508-AG11D-ESLCONN IC DIP SOCKET 8POS GOLD |
1,574 |
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Datasheet |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 125°C | - | Polyester | Copper Alloy |
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5-1437532-0CONN IC DIP SOCKET 28POS GOLD |
2,932 |
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Datasheet |
500 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Copper Alloy | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -55°C ~ 125°C | - | Polyester | Copper Alloy |
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516-AG12D-ESCONN IC DIP SOCKET 16POS TINLEAD |
4,940 |
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Datasheet |
500 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin-Lead | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Beryllium Copper |
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524-AG12DCONN IC DIP SOCKET 24POS TINLEAD |
2,903 |
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Datasheet |
500 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin-Lead | - | Beryllium Copper | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | - | Polyester | Brass, Copper |
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608-CG1TCONN IC DIP SOCKET 8POS GOLD |
2,697 |
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Datasheet |
600 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | - | 0.100" (2.54mm) | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | -65°C ~ 125°C | - | Thermoplastic, Polyester | Phosphor Bronze |
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6437540-7CONN IC DIP SOCKET 7POS GOLD |
3,774 |
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Datasheet |
800 | Bulk | Active | DIP, 0.75" (19.05mm) Row Spacing | 7 (1 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | 0.100" (2.54mm) | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | -55°C ~ 105°C | 80.0µin (2.03µm) | Polyester | Copper Alloy |
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8059-2G10CONN SOCKET TRANSIST TO-5 10POS |
1,782 |
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Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 10 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Tin-Lead | -55°C ~ 125°C | - | Polyamide (PA), Nylon | Brass |
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8059-2G3CONN SOCKET TRANSIST TO-5 4POS |
4,588 |
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Datasheet |
8059 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polyamide (PA), Nylon, Glass Filled | Brass |
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8059-2G6CONN SOCKET TRANSIST TO-5 8POS |
4,596 |
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Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Copper Alloy | - | Through Hole | Closed Frame | Solder | - | Tin | -55°C ~ 125°C | - | Polyamide (PA), Nylon | Copper Alloy |
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8059-2G7CONN SOCKET TRANSIST TO-5 8POS |
4,217 |
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Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Polyamide (PA), Nylon, Glass Filled | Brass |
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8080-1G10CONN SOCKET TRANSIST TO-3 3POS |
2,297 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Gold | 30.0µin (0.76µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Gold | -55°C ~ 125°C | - | Diallyl Phthalate (DAP) | Beryllium Copper |
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8080-1G16CONN SOCKET TRANSIST TO-3 3POS |
1,835 |
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Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | 50.0µin (1.27µm) | Beryllium Copper | - | Through Hole | Closed Frame | Solder | - | Silver | -55°C ~ 125°C | - | Diallyl Phthalate (DAP) | Beryllium Copper |
