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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
    10-8535-210C

    10-8535-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,462
    RFQ Sell Excess Inventory
    		10-8535-210C

    Datasheet

         		8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    10-8810-210C

    10-8810-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 4,944
    RFQ Sell Excess Inventory
    		10-8810-210C

    Datasheet

         		8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    14-8500-611C

    14-8500-611C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 2,331
    RFQ Sell Excess Inventory
    		14-8500-611C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 10.0µin (0.25µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1108883-05

    1108883-05

    SERIES 0517 PIN-LINE VERTISOCKET

    Aries Electronics

    		 3,827
    RFQ Sell Excess Inventory
    		1108883-05

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    1109800-14

    1109800-14

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    		 3,142
    RFQ Sell Excess Inventory
    		1109800-14

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-16

    1109800-16

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 3,229
    RFQ Sell Excess Inventory
    		1109800-16

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-20

    1109800-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    		 1,718
    RFQ Sell Excess Inventory
    		1109800-20

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-28

    1109800-28

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    		 1,903
    RFQ Sell Excess Inventory
    		1109800-28

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-10

    1109800-10

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 3,363
    RFQ Sell Excess Inventory
    		1109800-10

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-12

    1109800-12

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    		 2,106
    RFQ Sell Excess Inventory
    		1109800-12

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-22

    1109800-22

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    		 3,440
    RFQ Sell Excess Inventory
    		1109800-22

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-24

    1109800-24

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 1,882
    RFQ Sell Excess Inventory
    		1109800-24

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-26

    1109800-26

    CONN IC DIP SOCKET 26POS GOLD

    Aries Electronics

    		 2,093
    RFQ Sell Excess Inventory
    		1109800-26

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 26 (2 x 13) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109800-8

    1109800-8

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,817
    RFQ Sell Excess Inventory
    		1109800-8

    Datasheet

         		Correct-A-Chip® 1109800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Through Hole Programmable Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109681-308

    1109681-308

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 3,808
    RFQ Sell Excess Inventory
    		1109681-308

    Datasheet

         		- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Brass 0.100" (2.54mm) Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109681-316

    1109681-316

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    		 2,588
    RFQ Sell Excess Inventory
    		1109681-316

    Datasheet

         		- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Brass 0.100" (2.54mm) Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109681-632

    1109681-632

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,519
    RFQ Sell Excess Inventory
    		1109681-632

    Datasheet

         		- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Brass 0.100" (2.54mm) Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    1109681-648

    1109681-648

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    		 1,831
    RFQ Sell Excess Inventory
    		1109681-648

    Datasheet

         		- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Brass 0.100" (2.54mm) Through Hole Spacer Solder 0.100" (2.54mm) Tin-Lead - 200.0µin (5.08µm) Polyamide (PA46), Nylon 4/6, Glass Filled Brass
    54020-68030LF

    54020-68030LF

    CONN SOCKET PLCC 68POS TIN

    Amphenol ICC (FCI)

    		 2,597
    RFQ Sell Excess Inventory
    		54020-68030LF

    Datasheet

         		- Tube Obsolete PLCC 68 (4 x 17) Tin 100.0µin (2.54µm) Copper Alloy 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 100.0µin (2.54µm) Polyphenylene Sulfide (PPS) Copper Alloy
    54020-52030LF

    54020-52030LF

    CONN SOCKET PLCC 52POS TIN

    Amphenol ICC (FCI)

    		 2,495
    RFQ Sell Excess Inventory
    		54020-52030LF

    Datasheet

         		- Tube Obsolete PLCC 52 (4 x 13) Tin 100.0µin (2.54µm) Copper Alloy 0.050" (1.27mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin -40°C ~ 105°C 100.0µin (2.54µm) Polyphenylene Sulfide (PPS) Copper Alloy
    Total 19086 Record«Prev1... 940941942943944945946947...955Next»
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