IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Mating Mounting Style Features Termination Pitch - Post Contact Finish - Post Operating Temperature Contact Finish Thickness - Post Housing Material Contact Material - Post
8080-1G2

8080-1G2

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

1,284
8080-1G2

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Oval) Silver 500.0µin (12.70µm) Beryllium Copper - Through Hole Closed Frame Solder - Silver -55°C ~ 125°C - Diallyl Phthalate (DAP) Beryllium Copper
8080-1G3

8080-1G3

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

3,914
8080-1G3

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Oval) Tin-Lead 200.0µin (5.08µm) Beryllium Copper - Through Hole Closed Frame Solder - Tin-Lead -55°C ~ 125°C - Phenolic Beryllium Copper
8080-1G35

8080-1G35

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

2,722
8080-1G35

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Oval) Tin-Lead 200.0µin (5.08µm) Beryllium Copper - Chassis Mount Closed Frame Solder - Tin-Lead -55°C ~ 125°C 20.0µin (0.51µm) Diallyl Phthalate (DAP) Beryllium Copper
8080-1G36

8080-1G36

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

4,865
8080-1G36

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Oval) Silver 500.0µin (12.70µm) Beryllium Copper - Chassis Mount Closed Frame Solder - Silver -55°C ~ 125°C 500.0µin (12.70µm) Phenolic Beryllium Copper
8080-1G37

8080-1G37

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

3,159
8080-1G37

Datasheet

- Bulk Obsolete Transistor, TO-3 3 (Oval) Silver 500.0µin (12.70µm) Beryllium Copper - Chassis Mount Closed Frame Solder - Silver -55°C ~ 125°C 500.0µin (12.70µm) Diallyl Phthalate (DAP) Beryllium Copper
8-1437504-6

8-1437504-6

CONN SOCKET TRANSIST TO-3 3POS

TE Connectivity AMP Connectors

4,202
8-1437504-6

Datasheet

8080 Bulk Active Transistor, TO-3 3 (Oval) Gold 50.0µin (1.27µm) Beryllium Copper - Through Hole Closed Frame Solder - Gold -55°C ~ 125°C - Diallyl Phthalate (DAP) Beryllium Copper
824-AG66D

824-AG66D

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

2,532
824-AG66D

Datasheet

800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C 80.0µin (2.03µm) Polyester Copper Alloy
9-1437537-3

9-1437537-3

CONN IC DIP SOCKET 3POS GOLD

TE Connectivity AMP Connectors

3,054
9-1437537-3

Datasheet

800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C 80.0µin (2.03µm) Polyester Copper Alloy
9-1437539-6

9-1437539-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

2,675
9-1437539-6

Datasheet

800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead -55°C ~ 105°C 80.0µin (2.03µm) Polyester Copper Alloy
2040636-5

2040636-5

CONN SOCKET LGA 1567POS GOLD

TE Connectivity AMP Connectors

3,214
2040636-5

Datasheet

- Tray Active LGA 1567 Gold 30.0µin (0.76µm) Copper Alloy 0.040" (1.02mm) Surface Mount Open Frame Solder 0.039" (1.00mm) - - - Thermoplastic Copper Alloy
1977291-1

1977291-1

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

3,047
1977291-1

Datasheet

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 20.0µin (0.51µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic, Polyester Brass
8-1437529-1

8-1437529-1

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

4,594
8-1437529-1

Datasheet

500 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) Gold 20.0µin (0.51µm) Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Gold -55°C ~ 105°C 47.2µin (1.20µm) Thermoplastic, Polyester Copper Alloy
1825088-2

1825088-2

CONN IC DIP SOCKET 12POS GOLD

TE Connectivity AMP Connectors

4,829
1825088-2

Datasheet

- Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 20.0µin (0.51µm) Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Press-Fit 0.100" (2.54mm) - - - Thermoplastic, Polyester Brass
8-1437531-4

8-1437531-4

520-AG11F=SOCKET ASSY

TE Connectivity AMP Connectors

1,362
8-1437531-4

Datasheet

500 Bulk Active - - - - - - - - - - - - - - -
1747890-1

1747890-1

DSL ASSY LGA771 LEADED

TE Connectivity AMP Connectors

3,324
1747890-1

Datasheet

- Tray Active LGA 771 (33 x 33) - - Copper Alloy 0.043" (1.09mm) Surface Mount - Solder 0.043" (1.09mm) Tin -25°C ~ 100°C - Thermoplastic -
1-1981837-2

1-1981837-2

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors

3,536
1-1981837-2

Datasheet

- Tray Active LGA 1366 (32 x 41) Gold 30.0µin (0.76µm) Copper Alloy 0.040" (1.02mm) Surface Mount Open Frame Solder 0.040" (1.01mm) - - - Thermoplastic -
1825532-4

1825532-4

CONN SOCKET SIP 10POS GOLD

TE Connectivity AMP Connectors

2,707
1825532-4

Datasheet

- - Obsolete SIP 10 (1 x 10) Gold Flash Beryllium Copper 0.100" (2.54mm) Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Flash Polyester Beryllium Copper
4-2013620-3

4-2013620-3

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

1,928
4-2013620-3

Datasheet

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) Gold 15.0µin (0.38µm) Copper Alloy 0.039" (1.00mm) Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead - 15.0µin (0.38µm) Thermoplastic Copper Alloy
1-2013620-1

1-2013620-1

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

4,521
1-2013620-1

Datasheet

- Tape & Reel (TR) Active PGA, ZIF (ZIP) 989 (35 x 36) Gold 15.0µin (0.38µm) Copper Alloy 0.039" (1.00mm) Surface Mount Open Frame Solder 0.039" (1.00mm) Tin-Lead - 15.0µin (0.38µm) Thermoplastic Copper Alloy
9-6437529-4

9-6437529-4

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

3,819
9-6437529-4

Datasheet

- Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold - Beryllium Copper 0.100" (2.54mm) Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic, Polyester Brass
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